Results 251 to 260 of about 2,617,186 (294)
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Microsystem Technologies, 2004
Within this paper a concept for optimising a sensorguided high-precision assembly process is presented. The concept views the reduction of positioning time by parallizing the measurement and the movement process. After the introduction of the concept and theoretical aspects, an experimental system for implementation is presented.
S. Dittrich, P. Schlaich
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Within this paper a concept for optimising a sensorguided high-precision assembly process is presented. The concept views the reduction of positioning time by parallizing the measurement and the movement process. After the introduction of the concept and theoretical aspects, an experimental system for implementation is presented.
S. Dittrich, P. Schlaich
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2010
One of the key technologies for enabling 3D integration of semiconductor devices is the micro bump based interconnect joining that allows silicon dies with through-silicon vias (TSVs) to be stacked on each other. In order to achieve a high level of integration, the pitch and dimensions of these micro bumps also need to be reduced.
Paresh Limaye, Wenqi Zhang
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One of the key technologies for enabling 3D integration of semiconductor devices is the micro bump based interconnect joining that allows silicon dies with through-silicon vias (TSVs) to be stacked on each other. In order to achieve a high level of integration, the pitch and dimensions of these micro bumps also need to be reduced.
Paresh Limaye, Wenqi Zhang
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Micro planning for mechanical assembly operations
Proceedings. 1998 IEEE International Conference on Robotics and Automation (Cat. No.98CH36146), 2002Significant advances have been made in the area of macro-planning for assembly operations (i.e.,, dividing a product into sub-assemblies, determining the sequence of assembly operations). On the contrary, the state of the art in micro-planning (i.e., tool selection, path planning for tool and part movements) is rather primitive.
Gupta, S. K. +2 more
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Telepresence as a Solution to Manual Micro-Assembly
CIRP Annals, 2004Abstract The progressive miniaturization and customization of today's products has lead to increased demand for manual micro-assembly systems. Telepresence technologies provide a promising solution to manual micro-assembly through overcoming scaling barriers and achieving high accuracies, while offering flexibility and an intuitive human-controlled ...
Reinhart, G. +4 more
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An Advanced Collaborative Framework for Micro Assembly
2007 IEEE International Conference on Automation Science and Engineering, 2007This paper discusses the development of an advanced information modeling approach linked to the use of virtual and physical resources to support the rapid assembly of micro devices. An enterprise (engineering) modeling language (eEML) is used to create this information model.
Scott S. Boettner +2 more
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DNA‐Regulated Micro‐ and Nanoparticle Assembly
Small, 2007A novel use of DNA as a platform to tailor interparticle attraction and repulsion in micro- and nanosystems (see figure) is described. The total interparticle energy is regulated by balancing attractive forces generated by complementary DNA hybridization with steric repulsion provided by noncomplementary DNA.
Mathew M, Maye +3 more
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Information Centric Frameworks for Micro Assembly
2011This paper outlines an information centric framework involving cyber architectures and virtual reality simulation resources for micro devices assembly. Such a framework lends itself to cyber physical paradigms which hold significant potential in todays distributed collaborative engineering environments.
Raviteja Gunda +3 more
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Assembly sequence planning for automated micro assembly
(ISATP 2005). The 6th IEEE International Symposium on Assembly and Task Planning: From Nano to Macro Assembly and Manufacturing, 2005., 2006We describe a robust algorithm to do assembly sequence planning for open-loop microassembly. The algorithm detects collisions which may occur when executing an assembly sequence. If a collision exists, the assembly sequence is modified automatically (in order to avoid collisions).
T. Udeshi, K. Tsui
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Micro and Mesoscale Robotic Assembly
Journal of Manufacturing Processes, 2004Abstract Some of the challenges associated with Microsystems assembly are examined in this paper and illustrated with examples of ongoing research at the authors’ institution. One of the basic challenges in precision assembly is the need for very high accuracy over a large range of motion.
Dan O. Popa, Harry E. Stephanou
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A method for assembly of “parallel” micro-pipettes
Electroencephalography and Clinical Neurophysiology, 1968Abstract A method is described for cementing a single- or double-barrel recording glass micro-electrode parallel to, but projecting beyond, the orifice of a 5-barrel drug administering micro-pipette. These “parallel” micro-pipettes permit a study to be made of the post-synaptic action of as many as 5 different substances upon a single impaled neurone.
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