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Force-guided assembly of micro mirrors
Proceedings 2003 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2003) (Cat. No.03CH37453), 2004This paper aims at developing the force-guided microassembly technology with in-situ PVDF piezoelectric force sensing and control. By using the designed force sensors with the effective signal processing techniques, the micro contact force/impact signal and its derivative can be extracted and processed.
Xi, Ning, Shen, Yantao, Li, Wen Jung
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1997 8th International Conference on Advanced Robotics. Proceedings. ICAR'97, 2002
The decreasing size of mechanical components leads to a growing demand for suitable micro-assembly technology. However, there is still an enormous research potential given the required high assembly accuracies and the special problems encountered during the assembly of miniature components.
D. Zuhlke, R. Fischer, J. Hankes
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The decreasing size of mechanical components leads to a growing demand for suitable micro-assembly technology. However, there is still an enormous research potential given the required high assembly accuracies and the special problems encountered during the assembly of miniature components.
D. Zuhlke, R. Fischer, J. Hankes
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2017
The trend toward miniaturisation of the last decade has caused a real revolution in the manufacturing of many products and systems in several fields, trying to reduce volume and weight, and integrate more functions in a smaller space. Besides the various manufacturing techniques presented in the previous chapters of the book, growing interest has been ...
Serena Ruggeri +2 more
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The trend toward miniaturisation of the last decade has caused a real revolution in the manufacturing of many products and systems in several fields, trying to reduce volume and weight, and integrate more functions in a smaller space. Besides the various manufacturing techniques presented in the previous chapters of the book, growing interest has been ...
Serena Ruggeri +2 more
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Microsystem Technologies, 2004
Within this paper a concept for optimising a sensorguided high-precision assembly process is presented. The concept views the reduction of positioning time by parallizing the measurement and the movement process. After the introduction of the concept and theoretical aspects, an experimental system for implementation is presented.
S. Dittrich, P. Schlaich
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Within this paper a concept for optimising a sensorguided high-precision assembly process is presented. The concept views the reduction of positioning time by parallizing the measurement and the movement process. After the introduction of the concept and theoretical aspects, an experimental system for implementation is presented.
S. Dittrich, P. Schlaich
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, 2015 645658This chapter deals with assembly of micro-components with self-assembly techniques. It gives, first, an overview on the types of micro-assemblies and specific challenges to be met, which leads to the introduction to the self-assembly.
Burgard, Matthias
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Micro planning for mechanical assembly operations
Proceedings. 1998 IEEE International Conference on Robotics and Automation (Cat. No.98CH36146), 2002Significant advances have been made in the area of macro-planning for assembly operations (i.e.,, dividing a product into sub-assemblies, determining the sequence of assembly operations). On the contrary, the state of the art in micro-planning (i.e., tool selection, path planning for tool and part movements) is rather primitive.
Gupta, S. K. +2 more
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2010
One of the key technologies for enabling 3D integration of semiconductor devices is the micro bump based interconnect joining that allows silicon dies with through-silicon vias (TSVs) to be stacked on each other. In order to achieve a high level of integration, the pitch and dimensions of these micro bumps also need to be reduced.
Paresh Limaye, Wenqi Zhang
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One of the key technologies for enabling 3D integration of semiconductor devices is the micro bump based interconnect joining that allows silicon dies with through-silicon vias (TSVs) to be stacked on each other. In order to achieve a high level of integration, the pitch and dimensions of these micro bumps also need to be reduced.
Paresh Limaye, Wenqi Zhang
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An Advanced Collaborative Framework for Micro Assembly
2007 IEEE International Conference on Automation Science and Engineering, 2007This paper discusses the development of an advanced information modeling approach linked to the use of virtual and physical resources to support the rapid assembly of micro devices. An enterprise (engineering) modeling language (eEML) is used to create this information model.
Scott S. Boettner +2 more
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Telepresence as a Solution to Manual Micro-Assembly
CIRP Annals, 2004Abstract The progressive miniaturization and customization of today's products has lead to increased demand for manual micro-assembly systems. Telepresence technologies provide a promising solution to manual micro-assembly through overcoming scaling barriers and achieving high accuracies, while offering flexibility and an intuitive human-controlled ...
Reinhart, G. +4 more
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Programmable directed micro-assembly
Novel Patterning Technologies 2021, 2021We aim to develop the capability to rapidly sort, place, and orient micro objects into custom positions and transfer them to a final substrate eventually at costs similar to laser printers assembling toner particles onto paper. We are using programmable directed electrostatic parallel control to move particles from random to ordered patterns.
Eugene Chow +7 more
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