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Chiplet Micro-Assembly Printer
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019A deterministic, directed, parallel electrostatic assembly and transfer process is being developed to arrange chips for electronics applications. Singulated chips 10 um - 200 um in size and initially in solution, are sorted, transported and oriented to form programmed patterns.
Bradley B. Rupp +12 more
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ARRIpede: An Assembled Micro Crawler
2008 8th IEEE Conference on Nanotechnology, 2008Recent advances in MEMS fabrication, hybrid microassembly and packaging are expediting micomanufacturing of "die-size" microrobots. The ARRIpede is a 1cm times 1cm walking microrobot whose anatomy includes silicon based electrothermal prismatic actuators, vertical legs assembled to the actuators via complaint joints and an electronic "backpack" to make
Rakesh Murthy +2 more
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2010
Discover the latest models and methods for robotic microassembly from around the world. This book presents and analyzes new and emerging models and methods developed around the world for robotic microassembly, a new and innovative way to produce better microsystems.
Gauthier, Michaël, Régnier, Stéphane
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Discover the latest models and methods for robotic microassembly from around the world. This book presents and analyzes new and emerging models and methods developed around the world for robotic microassembly, a new and innovative way to produce better microsystems.
Gauthier, Michaël, Régnier, Stéphane
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Thermal Problems in Micro Assemblies
Hybrid Circuits, 1985Except in specific activities in electronic equipment, thermal management is not the most exciting subject for those involved in design. With micro-assembly (surface mounting of components) the cooling of components and PCB is now being seen in a new light. This paper, very rapidly, highlights the problems every designer has to take into account today.
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Micro Assembly Technology and System
2008Micro assembly refers to assembling micro size objects, such as integrated electronic circuits, micro mechanical components, and micro fluidic components. These objects are usually no bigger than 10 mm. Moreover, high accuracy (e.g. 1 µm) and high speed (e.g. 1 m/sec. or 10 m/sec2) are often required.
R. Du, Candy X. Y. Tang, D. L. Zhang
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YOLACT in Micro-Assembly Robot System
2021 4th International Conference on Algorithms, Computing and Artificial Intelligence, 2021Junsen Cheng +3 more
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Drying-Mediated Self-Assembly of Graphene for Inkjet Printing of High-Rate Micro-supercapacitors
Nano-Micro Letters, 2020Szymon Sollami Delekta +2 more
exaly