Results 81 to 90 of about 381 (138)
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THERMAL PERFORMANCES OF CROSS-FLOW MICROCHANNEL HEAT SINKS
Proceeding of Proceedings of CHT-21 ICHMT International Symposium on Advances in Computational Heat Transfer, 2021A numerical investigation is carried out that show how reasonably good thermal performances can be obtained with cross-flow microchannel heat sinks provided that an unequal number of microchannels is used in the two layers and a non-uniform microchannel inlet velocity distribution is produced by properly designed headers.
Nonino carlo, Stefano Savino
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Volume 4: Fatigue and Fracture; Fluids Engineering; Heat Transfer; Mechatronics; Micro and Nano Technology; Optical Engineering; Robotics; Systems Engineering; Industrial Applications, 2008
In the last few years high-tendency electronic devices have improved to a larger processing capability with smaller physical dimensions. This fact coupled to traditional cooling mechanisms, are not able to dissipate the high heat fluxes generated by these devices (around 200 W/cm2.) Microchannel heat sinks are the new tendency in heat dissipation. Many
Carlos A. Rubio-Jimenez +3 more
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In the last few years high-tendency electronic devices have improved to a larger processing capability with smaller physical dimensions. This fact coupled to traditional cooling mechanisms, are not able to dissipate the high heat fluxes generated by these devices (around 200 W/cm2.) Microchannel heat sinks are the new tendency in heat dissipation. Many
Carlos A. Rubio-Jimenez +3 more
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Flow Boiling in a Microchannel Heat Sink
Heat Transfer, Part A, 2005Flow boiling heat transfer in a microchannel heat sink is experimentally investigated. The microchannels considered are 275 μm wide and 636 μm deep, and the experiments are conducted at inlet water temperatures in the range of 66 to 95°C and mass fluxes of 341 to 936 kg/m2s.
Dong Liu, Suresh V. Garimella
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Heat sink optimization with application to microchannels
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992The equations governing the fluid dynamics and combined conduction/convection heat transfer in a heat sink are presented in dimensionless form for both laminar and turbulent flow. A scheme presented for solving these equations permits the determination of heat sink dimensions that display the lowest thermal resistance between the hottest portion of the
R.W. Knight +3 more
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Optimum Design of Microchannel Heat Sinks
Microelectromechanical Systems (MEMS), 1996Abstract Analyses have been performed to obtain momentum and thermal characteristics in microchannel heat sinks. The applicability of existing correlations for friction factor and Nusselt number is investigated. The study revealed that existing correlations based on the analytical results can predict the heat sink performance to within ...
Choquette, S. F. +3 more
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Metallic Nanoemulsion for Microchannel Heat-Sink
ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels, 2016Galinstan is a eutectic alloy of gallium, indium, and tin, of which thermal conductivity is ∼27 times higher than that of water, while the dynamic viscosity is only twice. Thus, heat transfer coefficient can be remarkably enhanced with a small penalty of pumping power.
Yoshikazu Hayashi +3 more
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Electroosmotically enhanced microchannel heat sinks
Journal of Mechanical Science and Technology, 2009The present study investigates the microchannel heat sink for pure electroosmotic, pressure-driven, and mixed (electroosmotic and pressure-driven) flows. A three-dimensional numerical analysis is performed for electroosmotic and mixed flows. Electroosmotic flow (EOF) induced in an ionic solution in the presence of surface charge and electric field is ...
Afzal Husain, Kwang-Yong Kim
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Measurements of heat transfer in microchannel heat sinks
International Communications in Heat and Mass Transfer, 2000Abstract The paper presents new experimental measurements for pressure drop and heat transfer coefficient in microchannel heat sinks. Tests were performed with devices fabricated using standard Silicon 100 wafers. Two different channel patterns were studied.
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Microchannel Heat Sinking: Analysis and Optimization
2009The present study reviews numerical optimizations of microchannel heat sink with the help of surrogate analysis. The design variables are decided from geometric and shape parameters that influence the performance of the microchannel heat sink. The basic surrogate models are explored with three-dimensional numerical analysis.
Afzal Husain, Kwang-Yong Kim
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Topology Optimization of Manifold Microchannel Heat Sinks
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020The manifold microchannel (MMC) heat sink has been widely studied for liquid-cooling of power-dense electronic components. Conventionally, thermal-fluid performance of an MMC heat sink is analyzed via unit cell simulations and designed by varying the rectangular fin and channel geometries, namely size optimization.
Yuqing Zhou +2 more
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