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Heat transfer and flow characteristics of a plate-fin heat sink equipped with copper foam and twisted tapes. [PDF]
HeliyonNilpueng K, Kaseethong P, Wongwises S.
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Green Methanol from CO <sub><b>2</b></sub> Hydrogenation at Industrial Scale: Progress, Challenges, and Perspectives. [PDF]
Chem Bio EngWang H, Ben J, Zhang S, Wang K, Xie P.
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Manifold microchannel heat sink topology optimisation
International Journal of Heat and Mass Transfer, 2021Abstract This study generates novel manifold microchannel heat sink structures for high heat flux cooling, by applying topology optimisation within a multi-objective 3D conjugate heat transfer model. Compared to rectangular manifold microchannels, the proposed structures reduce pressure drop by 17 % (7.2 kPa - 6.0 kPa) by suppressing stagnation ...
Nicholas Gilmore +2 more
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THERMAL PERFORMANCES OF CROSS-FLOW MICROCHANNEL HEAT SINKS
Proceeding of Proceedings of CHT-21 ICHMT International Symposium on Advances in Computational Heat Transfer, 2021A numerical investigation is carried out that show how reasonably good thermal performances can be obtained with cross-flow microchannel heat sinks provided that an unequal number of microchannels is used in the two layers and a non-uniform microchannel inlet velocity distribution is produced by properly designed headers.
Nonino carlo, Stefano Savino
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Electroosmotically enhanced microchannel heat sinks
Journal of Mechanical Science and Technology, 2009The present study investigates the microchannel heat sink for pure electroosmotic, pressure-driven, and mixed (electroosmotic and pressure-driven) flows. A three-dimensional numerical analysis is performed for electroosmotic and mixed flows. Electroosmotic flow (EOF) induced in an ionic solution in the presence of surface charge and electric field is ...
Afzal Husain, Kwang-Yong Kim
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Optimum Design of Microchannel Heat Sinks
Microelectromechanical Systems (MEMS), 1996Abstract Analyses have been performed to obtain momentum and thermal characteristics in microchannel heat sinks. The applicability of existing correlations for friction factor and Nusselt number is investigated. The study revealed that existing correlations based on the analytical results can predict the heat sink performance to within ...
Choquette, S. F. +3 more
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Volume 4: Fatigue and Fracture; Fluids Engineering; Heat Transfer; Mechatronics; Micro and Nano Technology; Optical Engineering; Robotics; Systems Engineering; Industrial Applications, 2008
In the last few years high-tendency electronic devices have improved to a larger processing capability with smaller physical dimensions. This fact coupled to traditional cooling mechanisms, are not able to dissipate the high heat fluxes generated by these devices (around 200 W/cm2.) Microchannel heat sinks are the new tendency in heat dissipation. Many
Carlos A. Rubio-Jimenez +3 more
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In the last few years high-tendency electronic devices have improved to a larger processing capability with smaller physical dimensions. This fact coupled to traditional cooling mechanisms, are not able to dissipate the high heat fluxes generated by these devices (around 200 W/cm2.) Microchannel heat sinks are the new tendency in heat dissipation. Many
Carlos A. Rubio-Jimenez +3 more
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Manifold microchannel heat sinks: isothermal analysis
InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V, 1997Numerical analyses of manifold microchannel (MMC) heat sinks were performed. The MMC differs from a traditional microchannel heat sink in that the flow length is greatly reduced to a small fraction of the total length of the heat sink. Alternating inlet and outlet channels guide the coolant to and from the microchannels.
D. Copeland, M. Behnia, W. Nakayama
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