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Topology Optimization of Manifold Microchannel Heat Sinks
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020The manifold microchannel (MMC) heat sink has been widely studied for liquid-cooling of power-dense electronic components. Conventionally, thermal-fluid performance of an MMC heat sink is analyzed via unit cell simulations and designed by varying the rectangular fin and channel geometries, namely size optimization.
Yuqing Zhou +2 more
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Metallic Nanoemulsion for Microchannel Heat-Sink
ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels, 2016Galinstan is a eutectic alloy of gallium, indium, and tin, of which thermal conductivity is ∼27 times higher than that of water, while the dynamic viscosity is only twice. Thus, heat transfer coefficient can be remarkably enhanced with a small penalty of pumping power.
Yoshikazu Hayashi +3 more
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Heat transfer optimization based on finned microchannel heat sink
International Journal of Thermal Sciences, 2022Abstract The straight microchannel heat sink is relatively low in heat transfer efficiency due to the influence of the thermal boundary layer, and the thermal requirements of which may fail to be met under high heat flux conditions. In this paper, the fins were introduced to form a secondary channel to optimize the heat dissipation effect of the ...
Furen Zhang, Bo Wu, Bolin Du
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Microchannel Heat Sinking: Analysis and Optimization
2009The present study reviews numerical optimizations of microchannel heat sink with the help of surrogate analysis. The design variables are decided from geometric and shape parameters that influence the performance of the microchannel heat sink. The basic surrogate models are explored with three-dimensional numerical analysis.
Afzal Husain, Kwang-Yong Kim
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Flow Boiling Oscillations in Microchannel Heat Sinks
9th AIAA/ASME Joint Thermophysics and Heat Transfer Conference, 2006*† The following presents flow boiling oscillation characteristics in two silicon microchannel heat sink configurations aimed at micro/nano- spacecraft thermal management. One is a conventional heat sink with 45 parallel channels, whereas the second is similar except with cross-links at 3 locations along the channels.
Roland Muwanga, Ibrahim Hassan
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Manifold Microchannel Heat Sinks: Numerical Analysis
Cooling and Thermal Design of Electronic Systems, 1995Abstract Numerical analyses of fluid flow and heat transfer in manifold microchannels were performed. The manifold microchannel differs from a traditional microchannel in that the flow length is greatly reduced to a small fraction of the total length of the heat sink.
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Analysis of flexible microchannel heat sink systems
International Journal of Heat and Mass Transfer, 2005Abstract In this work, single layered (SL) and double layered (DL) flexible microchannel heat sinks are analyzed. The deformation of the supporting seals is related to the average internal pressure by theory of elasticity. It is found that sufficient cooling can be achieved using SL flexible microchannel heat sinks at lower pressure drop values for ...
K. Vafai, A.-R.A. Khaled
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Measurements of heat transfer in microchannel heat sinks
International Communications in Heat and Mass Transfer, 2000Abstract The paper presents new experimental measurements for pressure drop and heat transfer coefficient in microchannel heat sinks. Tests were performed with devices fabricated using standard Silicon 100 wafers. Two different channel patterns were studied.
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Enhanced Microchannel Heat Sinks Using Oblique Fins
ASME 2009 InterPACK Conference, Volume 2, 2009Oblique fins created in a microchannel heat sink can serve to modulate the flow, resulting in local and global heat transfer enhancement. Numerical analysis of laminar flow and heat transfer in such modified microchannel heat sink showed that significant enhancement of heat transfer can be achieved with negligible pressure drop penalty. The breakage of
Yong-Jiun Lee +2 more
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Forced convection heat transfer in microchannel heat sinks
International Journal of Heat and Mass Transfer, 2007Abstract This paper presents an analysis of forced convection heat transfer in microchannel heat sinks for electronic system cooling. In view of the small dimensions of the microstructures, the microchannel is modeled as a fluid-saturated porous medium. Numerical solutions are obtained based on the Forchheimer–Brinkman-extended Darcy equation for the
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