Results 221 to 230 of about 26,223 (245)

Three-dimensional MMIC technology for low-cost millimeter-wave MMICs

GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuits Symposium. 22nd Annual Technical Digest 2000. (Cat. No.00CH37084), 2002
This paper highlights the key advantages of the three-dimensional (3D) MMIC technology in the millimeter-wave frequency band and demonstrates recently developed compact 3DMMICs. This paper also proposes a new methodology for MMIC development based on 3D/multilayer MMIC technology that greatly reduces the costs of millimeter-wave MMICs.
K. Nishikawa, K. Kamogawa, M. Tokumitsu, I. Toyoda, S. Sugitani, K. Araki   +5 more
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THE TRANSFORMING MMIC

International Journal of High Speed Electronics and Systems, 2003
In this paper, we describe two new DARPA initiatives addressing new concepts in compound semiconductor materials and architectures that will radically transform monolithic microwave integrated circuits (MMICs) technology to address future requirements for military and commercial sensors and mobile communication networks.
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Three-dimensional MMIC technology for low-cost millimeter-wave MMICs

IEEE Journal of Solid-State Circuits, 2001
This paper highlights the key advantages of the three-dimensional (3-D) MMIC technology in the millimeter-wave frequency band and describes recently developed compact 3-D MMICs on GaAs and Si substrates. The 3-D MMIC technology offers high integration levels, compactness, simple design procedures, and short fabrication turn-around time, resulting in ...
K. Nishikawa, K. Kamogawa, B. Piernas, M. Tokumitsu, S. Sugitani, I. Toyoda, K. Araki   +6 more
openaire   +1 more source

Three-dimensional MMIC technology and application to millimeter-wave MMICs

1997 Topical Symposium on Millimeter Waves. Proceedings (Cat. No.97TH8274), 2002
Three-dimensional MMIC is a significantly promising technology for accurate and easy design and low-cost fabrication of millimeter-wave MMICs. Passive circuit components and amplifiers in the 50 and 60-GHz bands are demonstrated.
T. Tokumitsu, K. Nishikawa, K. Karnogawa, I. Toyoda, K. Nishimura   +4 more
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A GaAs MMIC Digital Phase Modulator

27th European Microwave Conference, 1997, 1997
The paper introduces a GaAs MMIC digital phase modulator based on a lumped quadrature hybrid. The quadrature coupler is implemented using two interleaved spiral inductors in a transformer-like configuration. The phase control is obtained electronically tuning two L-C resonators that load the coupled ports.
G. Avitabile, CIDRONALI, ALESSANDRO, C. Salvador, MANES, GIANFRANCO   +3 more
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Low-Loss 140-175 GHz MMIC-to-Waveguide Transitions and MMIC-to-MMIC Interconnections

2021 51st European Microwave Conference (EuMC), 2022
Jian Ding, Xiaobang Shang, Chris Buck, Mike Geen, Nick Ridler   +4 more
openaire   +1 more source

European MMIC activities

IEEE International Digest on Microwave Symposium, 1988
A brief overview is given of the main monolithic microwave integrated circuit (MMIC) activities in four European countries. The contributions of seven companies are included, two each in England, France, and Germany, and one in Italy. Emphasis is on original contributions from the different groups.
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Application specific MMIC: a unique and affordable approach to MMIC development

IEEE 1988 Microwave and Millimeter-Wave Monolithic Circuits Symposium. Digest of Papers., 2003
The authors argue that application-specific monolithic microwave integrated circuits (ASMMICs) promise to simplify the development process and hence reduce the development cost and risk for the high levels of integration possible with GaAs microwave integrated circuits.
E. Turner, Z. Lemnios, S. Moghe, A. Podell, C. Korgell, R. Genin, H.-C. Huang   +6 more
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MMIC pioneers: A historical review of MMIC development at Raytheon

2009 IEEE MTT-S International Microwave Symposium Digest, 2009
The latter part of the 20th century saw the birth and rapid development of monolithic microwave integrated circuit (MMIC) technology which dramatically changed the microwave industry. Raytheon Company was at the forefront of this development. This presentation gives a historical review of the pioneering MMIC technology work done at Raytheon.
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Interconnects And Packaging For MMIC's

27th European Microwave Conference and Exhibition, 1997
This contribution reviews a number of aspects relevant for interconnects and packaging of monolithic integrated millimeter-wave circuits, possibly combined with hybrid or even waveguide circuits. Topics are packaging and front-end architecture, package materials, and standard interconnects to microstrip or coplanar MIMIC's.
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