Results 141 to 150 of about 95,973 (316)
Congruence Properties and Density Problems for the Fourier Coefficients of Modular Forms.
T. Hjelle, Torleiv Kløve
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The modular equation and modular forms of weight one [PDF]
Toyokazu Hiramatsu, Yoshio Mimura
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By fabricating and covalently assembling gelatin methacryloyl (GelMA) porous microgels, a new class of granular hydrogel scaffolds with hierarchical porosity is developed. These scaffolds have a significantly higher void fraction than their counterparts made up of nonporous microgels, enhancing cell recruitment and tissue integration. This research may
Alexander Kedzierski+9 more
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Construction of siegel modular forms of degree three and commutation relations of Hecke operators [PDF]
Yoshio Tanigawa
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Wearable Haptic Feedback Interfaces for Augmenting Human Touch
The wearable haptic feedback interfaces enhance user experience in gaming, social media, biomedical instrumentation, and robotics by generating tactile sensations. This review discusses and categorizes current haptic feedback interfaces into force, thermal, and electrotactile stimulation‐based haptic feedback interfaces, elucidating their current ...
Shubham Patel+3 more
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A dimension formula for Hermitian modular cusp forms of degree two [PDF]
Min King Eie
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This work investigates the Nernst effect in the Kagome magnet ErMn6Sn6 which exhibits both topological and anomalous Nernst effects with the anomalous Nernst coefficient reaching 1.71 µV K⁻¹ at 300 K. This value surpasses that of most canted antiferromagnetic materials, making ErMn6Sn6 a promising candidate for advancing thermoelectric devices based on
Olajumoke Oluwatobiloba Emmanuel+2 more
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Modular forms of half integral weight and the integral of certain theta-functions
Shinji Niwa
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Multi-tensors of differential forms on the siegel modular variety and on its subvarieties [PDF]
Shigeaki Tsuyumine
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Selective soldering via molten metal printing enables component integration, even in heat‐sensitive applications across fields like additive manufacturing, sustainable electronics, and smart textiles. This method overcomes the temperature limitations of existing technologies.
Dániel Straubinger+4 more
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