Results 111 to 120 of about 53,389 (317)
On Kloosterman sums connected with modular forms of half-itegral dimension [PDF]
, 1964 Marvin I. Knopp, John Smart
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Advanced Engineering Materials, EarlyView.Herein, silicon‐based nanoparticle coatings on X2CrNiMo17‐12‐2 metal powder are presented. The coating process scale, process parameters, nanoparticle size (65–200 nm) as well as the coating amount are discussed regarding powder properties. The surface roughness affects the flowability, while reflectance depends on the coating material and surface ...
Arne Lüddecke +4 more
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Linear relations between modular forms for Г0+(p)
Open Mathematics, 2015 We find linear relations among the Fourier coefficients of modular forms for the group Г0+(p) of genus zero. As an application of these linear relations, we derive congruence relations satisfied by the Fourier coefficients of normalized Hecke eigenforms.
Choi SoYoung, Kim Chang Heon
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Advanced Engineering Materials, EarlyView.Unlocking structural efficiency, this work integrates homogenization‐based topology optimization with functionally graded triply periodic minimal surface lattices to create highly efficient, customizable lattice structures. Key achievements include the development of a versatile MATLAB framework, optimization of mechanical properties for additive ...
Mirhan Ozdemir +4 more
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Advanced Engineering Materials, Volume 27, Issue 13, July 2025.Laser powder‐bed fusion (L‐PBF) can produce dense WE43 magnesium alloy parts, but their mechanical properties are limited by a nonhomogeneous microstructure. This study investigates the effects of varying direct aging (T5) and artificial age‐hardening (T6) conditions on microstructure and strength. Optimized T6 treatment significantly improves strength
Prathviraj Upadhyaya +5 more
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Shape Memory Polymer‐Based Hook‐and‐Loop Fastener for Robust Bonding and on‐Demand Easy Separation
Advanced Engineering Materials, Volume 27, Issue 13, July 2025.A 3D shape memory polymer‐based hook‐and‐loop fastener, fabricated using projection microstereolithography and molding, offers tunable bonding strength through temperature control. When heated from 25 to 70 °C, the fastener softens and deforms easily, reducing bonding strength by 20‐fold for on‐demand easy separation.
Chen Yang +5 more
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Advanced Engineering Materials, EarlyView.The share of technical thermoplastics is expected to grow further in the e‐mobility segment. In this study, a detailed temperature‐based tribological characterization of technical thermoplastics is performed. The tribological properties are discussed in terms of the dynamic mechanical properties of polymers at different ambient temperatures. A proof of
Harsha Raghuram +2 more
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Non-holomorphic modular flavor symmetry
Journal of High Energy PhysicsThe formalism of non-holomorphic modular flavor symmetry is developed, and the Yukawa couplings are level N polyharmonic Maaß forms satisfying the Laplacian condition.
Bu-Yao Qu, Gui-Jun Ding
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