Results 231 to 240 of about 1,280,473 (359)

Device Integration Technology for Practical Flexible Electronics Systems

open access: yesAdvanced Functional Materials, EarlyView.
Flexible device integration technologies are essential for realizing practical flexible electronic systems. In this review paper, wiring and bonding techniques critical for the industrial‐scale manufacturing of wearable devices are emphasized based on flexible electronics.
Masahito Takakuwa   +5 more
wiley   +1 more source

Memristive floating-point Fourier neural operator network for efficient scientific modeling. [PDF]

open access: yesSci Adv
Li J   +11 more
europepmc   +1 more source

Wafer‐Scale Integration of α‐quartz Thin Films toward Super High Frequency Piezoelectric bioNEMS for Chikungunya Virus Detection

open access: yesAdvanced Functional Materials, EarlyView.
Epitaxial piezoelectric α‐quartz/Si BioNEMS sensors, made using soft chemistry, effectively detect the Chikungunya virus. They have a mass sensitivity of 205 pg Hz−1 in liquid and can detect the virus at a limit of 9 ng mL−1. This development enables high‐frequency mass devices for point‐of‐care testing in healthcare and other electronic applications ...
Raissa Rathar   +12 more
wiley   +1 more source

Peak‐in‐Valley Metal Nano‐Architectures via E‐Beam‐Guided Metal Oxide Redox

open access: yesAdvanced Functional Materials, EarlyView.
Focused electron beam irradiation of nanoelectrosprayed water‐ammonia films enables the synthesis of topologically complex metal nanostructures via solvent‐mediated metal/metal‐ion redox control. Low ammonia favors radiolytic oxidation, etching copper.
Auwais Ahmed, Andrei G. Fedorov
wiley   +1 more source

Microscale Tin–Bismuth Alloy Prepared via Cooling Rate Control as Anode Material for High‐Performance Lithium‐Ion Batteries

open access: yesAdvanced Functional Materials, EarlyView.
To investigate the mechanisms about the enhanced buffering effect and morphological retention in fully lithiated Sn–Bi alloys, this study introduces a new bulk bimetallic Sn–Bi alloy with fine grains of uniformly distributed Sn and Bi alloys (≈50 nm) via cooling rate control. This design effectively relieves internal energy buildup and suppresses crack
Hyeon Seo Park   +6 more
wiley   +1 more source

Multiplication Operators on Incidence Algebras [PDF]

open access: yesIndiana University Mathematics Journal, 1970
openaire   +2 more sources

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