Results 161 to 170 of about 2,288,779 (293)

Surface Segregation in Compositionally Complex Ag‐Au‐Pd‐Pt Solid Solutions: Insights From High‐Throughput Experimentation and Atomistic Simulations

open access: yesAdvanced Materials Interfaces, EarlyView.
Surface segregation in quaternary Ag‐Au‐Pd‐Pt compositionally complex solid solutions is systematically mapped across 684 compositions by combining high‐throughput EDX and XPS characterization of co‐sputtered thin‐film libraries with large‐scale MD/MC atomistic simulations.
Ridha Zerdoumi   +10 more
wiley   +1 more source

Nature‐Derived Chitosan Biopolymer: A Promising Candidate for Sustainable Electronics

open access: yesAdvanced Materials Technologies, EarlyView.
In the creation of environmentally friendly devices, nature‐derived chitosan biopolymer is a promising contender for sustainable electronic research. It can be utilized to create more ecologically friendly scalable gadgets and has a variety of uses in different active layers of electronics.
Joshua McDonald   +3 more
wiley   +1 more source

Advanced Manufacturing of Composite‐Based Systems for Energy Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Advanced manufacturing enables the integration of polymers, ceramics, metal oxides, and composites into architected microstructures with tailored transport pathways. By coupling material selection, manufacturing strategy, and structural design, multifunctional energy systems can simultaneously improve electrochemical performance, thermal management ...
Sri Vaishnavi Thummalapalli   +13 more
wiley   +1 more source

Atomic-Scale Tailoring of Ni-Rich Cathodes for the Development of Commercial Li-Ion Batteries: From Laboratory to Market. [PDF]

open access: yesAdv Sci (Weinh)
Kang J   +15 more
europepmc   +1 more source

Copper Electroplated TPMS Polymer Lattices for Lightweight Absorption Dominant Electromagnetic Interference Shielding

open access: yesAdvanced Materials Technologies, EarlyView.
Copper electroplating transforms lightweight 3D‐printed TPMS polymer lattices into effective electromagnetic shields. Topology, relative density, and conductive seed layer continuity govern copper penetration, electrical resistance, and attenuation. SEA consistently exceeds SER, while 35% RD Diamond lattice gives the best performance, reaching 48.72 dB
Aman Al Khatib   +6 more
wiley   +1 more source

Two‐Step Thermal Upcycling of Flexible Printed Circuit Board Waste Into Metallic Copper Nanoparticles: Synthesis and Characterization

open access: yesAdvanced Materials Technologies, EarlyView.
A two‐step thermal upcycling process converts flexible printed circuit board waste into high‐purity copper nanoparticles using polymer degradation and arc discharge. The synthesized nanoparticles exhibit controlled morphology and high metal purity.
Bikesh S. Ghinangju   +2 more
wiley   +1 more source

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