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Electromagnetic Non-Destructive Evaluation (VIII)
2004This publication presents the intentions of the ENDE International Standing Committee to enable a fruitful and synergistic investigation of Electromagnetic Non-Destructive Evaluation. Indeed, this topic is crucial to an increasing number of engineering activities and environmental evaluation and protection issues, and it requires theoretical insight ...
Sollier, Thierry +2 more
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Infrared Thermography for Temperature Measurement and Non-Destructive Testing
Sensors, 2014Ruben Usamentiaga +2 more
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Non-Destructive Techniques Based on Eddy Current Testing
Sensors, 2011Javier García-Martin +1 more
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Non-destructive evaluation of microelectronic components
2008Popcorn package cracking in plastic IC packaging can be classified into three types: Type I referring to failure originating from delamination between the mold compound and die pad interface, Type II originating from the die attach region, and Type in originating from the interface between the mold compound and the silicon die.
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Dedicated non-destructive devices for food quality measurement: A review
Trends in Food Science and Technology, 2018Sadjad Abasi +2 more
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Development and Application of Infrared Thermography Non-Destructive Testing Techniques
Sensors, 2020Peng Jiang, Weixu Zhang
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Non-destructive testing and evaluation
IEE Proceedings - Science, Measurement and Technology, 2001openaire +1 more source
Advances and Researches on Non Destructive Testing: A Review
Materials Today: Proceedings, 2018Sandeep Kumar Dwivedi +2 more
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