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Infrared Thermography for Temperature Measurement and Non-Destructive Testing
Sensors, 2014Pablo Venegas +2 more
exaly
Non-destructive evaluation of microelectronic components
2008Popcorn package cracking in plastic IC packaging can be classified into three types: Type I referring to failure originating from delamination between the mold compound and die pad interface, Type II originating from the die attach region, and Type in originating from the interface between the mold compound and the silicon die.
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Non-destructive Evaluation of Welds - An Overview
Indian Welding Journal, 2011B. Venkatraman, M. Menaka
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Dedicated non-destructive devices for food quality measurement: A review
Trends in Food Science and Technology, 2018Bahareh Jamshidi +2 more
exaly
Non-Destructive Evaluation of Engineering Ceramics
Key Engineering Materials, 1998T. Kishi, J.H. Koo
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