Results 251 to 260 of about 184,922 (274)
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The Effect of Padded Adhesive Dressing and Static Body Position on Sacral Interface Pressure
Journal of Patient Safety, 2020Objectives Padded adhesive bandages are frequently used in the inpatient setting for sacral pressure injury prevention, but it is unclear whether they truly decrease interface pressure. We hypothesized such devices reduce sacral peak interface pressure in the supine position, which would be further reduced in 30-degree reclined
Michelle, Seu +6 more
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Planar polishing process method based on real-time dressing of a polishing pad surface
Applied Optics, 2022Planar polishing is an important manufacturing process for high-precision planar components. In this study, a real-time dresser and a planar polishing process based on real-time dressing for large-aperture optical plane components were developed. Efficient dressing of a polishing pad surface can be achieved with the real-time dresser. Compared with the
Lingyu, Zhao +5 more
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The In-Situ Dressing of CMP Pad Conditioners with Novel Coating Protection
Materials Science Forum, 2007Kinik Company pioneered diamond pad conditioners protected by DLC barrier (DiaShield® Coating) back in 1999 (Sung & Lin, US Patent 6,368,198) and there has been no follower since then. Kinik's offered two varieties of DiaShield® Coatings: ultrahard tetrahedral amorphous carbon and superhard hydrogenated DLC.
James C. Sung, Ming Chi Kan
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Study on pad cutting rate and surface roughness in diamond dressing process
International Journal of Precision Engineering and Manufacturing, 2017Diamond dressing process has an important role in the elimination of scrap materials on the pad surface and regeneration of the pad surface topography before and after Chemical Mechanical Planarization/Polishing (CMP) process for integrated circuit (IC) fabrication.
Quoc-Phong Pham, Chao-Chang A. Chen
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Factors influencing the dressing rate of chemical mechanical polishing pad conditioning
International Journal of Advanced Manufacturing Technology, 2006The primary consumables in the chemical mechanical polishing (CMP) process are the polishing pad and the slurry. Among those consumables, the polishing pad significantly influences the stability of the process and the cost of consumables (CoC). Furthermore, the small holes on the pad surface will be filled by the reactant from the CMP process, and the ...
Pei-Lum Tso, Shuo-Young Ho
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DRESSING CHARACTERISTICS OF ORIENTED SINGLE DIAMOND ON CMP POLYURETHANE PAD
Machining Science and Technology, 2009Diamond conditioners or dressers are commonly used to dress polishing pads that are applied in the chemical mechanical polishing (CMP) of silicon wafers for integrated circuits. In this work the fundamental characteristics of dressing action on the polyurethane pad are investigated for dressing by a single diamond with various shapes (point-cutting ...
Tsai, M.Y., Liao, Y.S.
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Qualitative Motion Control Optimization of the Pad Dressing Process for Bonnet Tool
IEEE/ASME Transactions on Mechatronics, 2019The surface quality of polyurethane pad attached to the polishing tool is of great importance to the polishing performance, and it is usually maintained by a dressing process. In this study, in order to improve the pad dressing quality, optimization of motion control during the dressing process is presented, from the aspects of the uniformity of the ...
Ri Pan +6 more
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Water-jet-assisted diamond disk dressing characteristics of CMP polishing pad
International Journal of Advanced Manufacturing Technology, 2011This paper presents an experimental investigation of the dressing characteristics of a porous polishing pad using a combination of water-jet dressing (WJC) and traditional diamond disk dressing (DDC). The WJC and DDC dressing mechanisms were integrated in order to improve the dressing efficiency. The pad recovery test was performed.
Ming-Yi Tsai
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Macromodel for changes in polishing pad surface condition caused by dressing and polishing
Japanese Journal of Applied Physics, 2013A macromodel for changes in a pad surface by dressing and polishing is proposed. A polishing pad is divided into small areas and it is assumed that each area takes an “H” (= high) or “L” (= low) condition. The condition is changed by dressing or polishing, and the total chemical mechanical planarization (CMP) performance is determined by the average ...
Akira Isobe +2 more
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Study on diamond dressing for non-uniformity of pad surface topography in CMP process
International Journal of Advanced Manufacturing Technology, 2017Diamond dressing process is critical in conditioning pad surface topography before and after chemical mechanical planarization/polishing (CMP) process for integrated circuit (IC) fabrication. This paper addresses a kinematic model of diamond dressing effect on the profile of pad cutting rate (PCR) with a ring-type diamond dresser through both ...
Chao-Chang A. Chen, Quoc-Phong Pham
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