Results 201 to 210 of about 1,953,706 (347)
Electron correlation and incipient flat bands in the Kagome superconductor CsCr<sub>3</sub>Sb<sub>5</sub>. [PDF]
Li Y+18 more
europepmc +1 more source
Carbon nanomembranes with ultra‐thin Al2O3 functionalization are less than 15 nm thin and exhibit outstanding permeation performance with a water vapor/nitrogen selectivity higher than 1 × 104, twice that of pristine CNMs, and an exceptionally high water vapor permeation rate for potential applications in air dehumidification.
Jan Biedinger+10 more
wiley +1 more source
Operational radiation protection in high-energy physics accelerators [PDF]
S. Rokni, A. Fassò, J. C. Liu
openalex +1 more source
Shielding disc backscatter calculations in intraoperative radiotherapy using a Monte Carlo simulation based on the method of energy spectra reconstruction. [PDF]
Ryczkowski A+6 more
europepmc +1 more source
A materials and device design concept that comprises a self‐assembled ultra‐thin epitaxial ion‐transporting layer, an amorphous oxide overcoat oxygen‐blocking layer, and a partial filament formed during an electroforming step is proposed for low‐current multilevel resistive switching devices.
Ming Xiao+17 more
wiley +1 more source
Colossal magnetoresistance from spin-polarized polarons in an Ising system. [PDF]
Li YF+14 more
europepmc +1 more source
Mesenchymal stem cell‐derived nanoghosts (MSC‐NGs) mimic naturally secreted extracellular vesicles (MSC‐EVs) in structure and physicochemical properties but can be synthesized at more translatable yields. As osteogenic agents, MSC‐NGs demonstrate superior outcomes compared to MSC‐EVs.
Antoine Karoichan+4 more
wiley +1 more source
Strange particle physics with intense pion beams: Prospects for PILAC (Pion Linear Accelerator)
C. B. Dover
openalex +1 more source
Evaluating statistical consistency for the ocean component of earth system models using physics informed convolutional autoencoder. [PDF]
Yu Y+10 more
europepmc +1 more source
Selective soldering via molten metal printing enables component integration, even in heat‐sensitive applications across fields like additive manufacturing, sustainable electronics, and smart textiles. This method overcomes the temperature limitations of existing technologies.
Dániel Straubinger+4 more
wiley +1 more source