Results 11 to 20 of about 352,841 (329)
The application of Taguchi approach to optimise the processing conditions on bonnet polishing of CoCr [PDF]
, 2012 This paper applied the Taguchi approach to investigate the effects of each polishing parameter and obtain the optimal processing conditions for CoCr alloy polishing.
Blunt, Liam, Jiang, Xiang, Zeng, Shengye
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The surface structure of polishing pads for polishing using composite abrasives
Nihon Kikai Gakkai ronbunshu, 2016 Cerium oxide (CeO2) abrasives are generally used in the glass polishing because high removal rate and smooth glass surface can be obtained. However, CeO2 abrasives have problems with dispersion of slurry and cleaning from glass surface.
Naoaki ICHINOHO +3 more
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Fabrication and Polishing Performance of Diamond Self-Sharpening Gel Polishing Disk
Micromachines, 2023 A diamond gel polishing disk with self-sharpening ability is proposed to solve the problem of glazing phenomenon in the gel polishing disks. Aluminum nitride (AlN) powder with silica sol film coating (A/S powder) is added to the polishing disk, and a ...
Lanxing Xu +3 more
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Roughness evolution of previously milled samples along a polishing test [PDF]
, 2016 In the present work results about roughness evolution along a polishing operation with corundum disks of size Norton 400 are presented. Hardened steel and hardened stainless steel samples were previously subjected to ball-end milling or side milling with
Buj Corral, Irene, Vivancos Calvet, Joan
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Study on electrochemical polishing of TC4 alloy
Materials Research Express, 2021 Using an environmentally friendly acid-alcohol system solution for electrochemical polishing of 3D printed titanium alloy, a typical U-I polarization curve was obtained, and explained the mechanism of electrochemical polishing.
Shan-Fei Wang +6 more
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Additive Manufacturing Letters, 2023 Microstructural characterization has a key role in analyzing the properties of additive manufactured materials. Electron backscatter diffraction (EBSD) can offer a unique set of information on the microstructural state of these materials.
Erfan Maleki +5 more
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W-CMP for sub-micron inverse metallisation [PDF]
, 1997 Chemical Mechanical Polishing (CMP) of tungsten for an inverse metallisation scheme is investigated. The influence of CMP parameters on removal rate and uniformity is studied. The main effects on the removal rate are the applied pressure and the rotation
Corbach, Herman D. van +3 more
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Analysis of material removal behavior and subsurface damage in linear polishing of silicon wafers with tangential vibration on rough surfaces [PDF]
AIP AdvancesThis research investigated the polishing treatment of silicon wafer rough surfaces using molecular dynamics simulations. The material removal behavior of tangential vibration polishing and linear polishing was analyzed in detail.
Shuilin Rao +5 more
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Influence of different polishing materials in the material removal of steel samples [PDF]
, 2018 The quality of injection moulded polymer optic parts depends on the surface finish of the respective mould. In order to improve and control the surface finish of the mould it is important to be able to keep the material removal constant during the ...
Almeida, Rui +3 more
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Formalized Mathematics, 2015 Abstract This article is the first in a series formalizing some results in my joint work with Prof. Joanna Golinska-Pilarek ([12] and [13]) concerning a logic proposed by Prof. Andrzej Grzegorczyk ([14]). We present some mathematical folklore about representing formulas in “Polish notation”, that is, with operators of ...
openaire +3 more sources