Results 11 to 20 of about 58,847 (243)

Optimization of CMP processing parameters for Si based on response surface method

open access: yesJin'gangshi yu moliao moju gongcheng, 2022
To improve the polishing efficiency and precision, the optimum processing parameters of Si in the chemical mechanical polishing (CMP) process were analysed by CMP experiments and response surface methodology.
Da BIAN   +4 more
doaj   +1 more source

The surface structure of polishing pads for polishing using composite abrasives

open access: yesNihon Kikai Gakkai ronbunshu, 2016
Cerium oxide (CeO2) abrasives are generally used in the glass polishing because high removal rate and smooth glass surface can be obtained. However, CeO2 abrasives have problems with dispersion of slurry and cleaning from glass surface.
Naoaki ICHINOHO   +3 more
doaj   +1 more source

Study on electrochemical polishing of TC4 alloy

open access: yesMaterials Research Express, 2021
Using an environmentally friendly acid-alcohol system solution for electrochemical polishing of 3D printed titanium alloy, a typical U-I polarization curve was obtained, and explained the mechanism of electrochemical polishing.
Shan-Fei Wang   +6 more
doaj   +1 more source

Analysis of material removal behavior and subsurface damage in linear polishing of silicon wafers with tangential vibration on rough surfaces [PDF]

open access: yesAIP Advances
This research investigated the polishing treatment of silicon wafer rough surfaces using molecular dynamics simulations. The material removal behavior of tangential vibration polishing and linear polishing was analyzed in detail.
Shuilin Rao   +5 more
doaj   +1 more source

Polish Notation [PDF]

open access: yesFormalized Mathematics, 2015
Abstract This article is the first in a series formalizing some results in my joint work with Prof. Joanna Golinska-Pilarek ([12] and [13]) concerning a logic proposed by Prof. Andrzej Grzegorczyk ([14]). We present some mathematical folklore about representing formulas in “Polish notation”, that is, with operators of ...
openaire   +3 more sources

The Relationship between Polishing Method and ISE Effect

open access: yesCrystals, 2023
The aim of the submitted work is to study the relationship between the method of polishing the metallurgical surface and the indentation size effect (ISE). The material of the sample was annealed 99.5% aluminum.
Jozef Petrík   +6 more
doaj   +1 more source

Advantages of Electrochemical Polishing of Metals and Alloys in Ionic Liquids

open access: yesMetals, 2021
Electropolishing of metal surfaces is a benign alternative to mechanical treatment. Ionic liquids are considered as green electrolytes for the electropolishing of metals.
Olga Lebedeva   +3 more
doaj   +1 more source

Effect of Nozzle Geometry on Erosion Characteristics in Abrasive Water Jet: Experimental and Numerical Analysis

open access: yesLubricants
In the field of abrasive-water-jet polishing technology, the influence of nozzle geometry on nozzle wear and internal-structure erosion in abrasive-water-jet polishing technology is studied, and the nozzle design is optimized through experiments and a ...
Xuhong Chen, Haihong Pan, Lin Chen
doaj   +1 more source

The systematic design and prototype verification of cam-linkage polishing devices with double-circle polishing traces

open access: yesAdvances in Mechanical Engineering, 2018
The optimum polishing traces are the double-circle polishing traces with zero-velocity deviation percentage ( V dp  = 0%). In 1997, Buzzetti used the relatively high-cost programmable logic controller to control the polishing device having double-circle ...
Tzu-Hsia Chen
doaj   +1 more source

Fabrication and evaluation of a CMOS-based energy harvesting chip integrating photovoltaic and thermoelectric energy harvesters

open access: yesEnergy Conversion and Management: X
This study explores the development of an energy harvesting chip (EHC) using a complementary metal oxide semiconductor (CMOS) process, addressing the need for efficient micro-scale energy harvesters in modern electronics.
Zhi-Xuan Dai, Chun-Yu Chen
doaj   +1 more source

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