Results 111 to 120 of about 1,972 (161)

Near-Infrared Spectral MEMS Gas Sensor for Multi-Component Food Gas Detection. [PDF]

Micromachines (Basel)
Yan X, Tan Y, Wang Y, Chen G, Xia W, Zhou G, Luo H, Liu H, Gong T, Zhang X.   +9 more
europepmc   +1 more source

A High-Density 4H-SiC MOSFET Based on a Buried Field Limiting Ring with Low Q_gd and R_on. [PDF]

Micromachines (Basel)
Cui W, Guo J, Xu H, Zhang DW.
europepmc   +1 more source

Hole-Selective SiN _x and AlO _x Tunnel Nanolayers for Improved Polysilicon Passivating Contacts. [PDF]

ACS Appl Energy Mater
McNab S, Morisset A, Libraro S, Genç E, Niu X, Swallow JEN, Wilshaw P, Weatherup RS, Wright M, Haug FJ, Bonilla RS.   +10 more
europepmc   +1 more source

Review of Research Advances in Gyroscopes' Structural Forms and Processing Technologies Viewed from Performance Indices. [PDF]

Sensors (Basel)
Luo H, Su H, Tang Q, Nisa FU, He L, Zhang T, Liu X, Liu Z.   +7 more
europepmc   +1 more source

Theoretical and experimental investigations of the CMOS compatible Pirani gauges with a temperature compensation model. [PDF]

Microsyst Nanoeng
Xu S, Yang G, Chen J, Jiao R, Wang R, Yu H, Xie H, Wang X.   +7 more
europepmc   +1 more source

Novel 4H-SiC Double-Trench MOSFETs with Integrated Schottky Barrier and MOS-Channel Diodes for Enhanced Breakdown Voltage and Switching Characteristics. [PDF]

Nanomaterials (Basel)
Wang P, Li C, Deng C, Yang Q, Xu S, Tang X, Wang Z, Tao W, Tao N, Wang Q, Yu H.   +10 more
europepmc   +1 more source

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Capacitance Voltage Characteristics of Polysilicon–Polysilicon Oxide–Polysilicon Structures for Three-Dimensional Memory

MRS Proceedings, 2000
ABSTRACTThree-dimensional integration offers a dramatic reduction in chip area required per bit and has long been a research objective. Three-dimensional integration with thin film transistors (TFTs) requires detailed parametric analysis with techniques such as Capacitance-Voltage (CV) Characterization.
John R. Lindsey, T. S. Kalkur
openaire   +1 more source

Polysilicon angular microvibromotors

Journal of Microelectromechanical Systems, 1992
Two types of LPCVD polysilicon angular microvibromotors were designed, fabricated, and successfully operated in air and in vacuum. Each utilizes an electrostatically driven lateral resonant structure (the converter) to actuate a circular microrotor by means of oblique mechanical impact.
A.P. Lee, A.P. Pisano
openaire   +2 more sources