Results 141 to 150 of about 11,162 (212)
High frame rate ultrasonic flowmeter based on PMUT array with bidirectional acoustic beams. [PDF]
Gao Y +7 more
europepmc +1 more source
Integrated multi-port multi-wavelength coherent optical source for beyond Tb/s optical links. [PDF]
Pirmoradi A +6 more
europepmc +1 more source
Polymer-Based Chemicapacitive Hybrid Sensor Array for Improved Selectivity in e-Nose Systems. [PDF]
Munirathinam P +4 more
europepmc +1 more source
MEMS Micromirror Actuation Techniques: A Comprehensive Review of Trends, Innovations, and Future Prospects. [PDF]
Ahmad M, Bahri M, Sawan M.
europepmc +1 more source
Capacitive Sensors and Actuators by CMOS MEMS Foundry. [PDF]
Yang LJ +5 more
europepmc +1 more source
ABSTRACTThree-dimensional integration offers a dramatic reduction in chip area required per bit and has long been a research objective. Three-dimensional integration with thin film transistors (TFTs) requires detailed parametric analysis with techniques such as Capacitance-Voltage (CV) Characterization.
John R. Lindsey, T. S. Kalkur
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Microstructures of Polysilicon
ABSTRACTSome typical microstructural studies of polycrystalline silicon using transmission electron microscopy (TEM) are described, including the application of this material for assisting TEM investigations themselves. Examples include oxidation and realignment of polysilicon thin films, the structure of polysilicon in EEPROM devices, polysilicon in ...
R. Sinclair +3 more
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AbstractPolycrystalline silicon has found numerous applications in silicon integrated circuits, initially as a MOS gate material, and later for advanced isolation, capacitor electrodes, resistors, interconnect, bipolar emitters and bases, trench refill, doping sources, and the active material in thin film transistors. Integration of these techniques in
J. Ellul, I.D. Calder
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The sacrificial etch technology for fabricating free-standing three-dimensional microstructures in polysilicon has been successfully implemented. A variety of techniques for reducing the intrinsic compressive stress have been employed in fabricating low ...
M.M. Farooqui, A.G.R. Evans
openaire +2 more sources

