Results 141 to 150 of about 11,162 (212)

High frame rate ultrasonic flowmeter based on PMUT array with bidirectional acoustic beams. [PDF]

open access: yesMicrosyst Nanoeng
Gao Y   +7 more
europepmc   +1 more source

Integrated multi-port multi-wavelength coherent optical source for beyond Tb/s optical links. [PDF]

open access: yesNat Commun
Pirmoradi A   +6 more
europepmc   +1 more source

Capacitive Sensors and Actuators by CMOS MEMS Foundry. [PDF]

open access: yesMicromachines (Basel)
Yang LJ   +5 more
europepmc   +1 more source

Capacitance Voltage Characteristics of Polysilicon–Polysilicon Oxide–Polysilicon Structures for Three-Dimensional Memory

open access: yesMRS Proceedings, 2000
ABSTRACTThree-dimensional integration offers a dramatic reduction in chip area required per bit and has long been a research objective. Three-dimensional integration with thin film transistors (TFTs) requires detailed parametric analysis with techniques such as Capacitance-Voltage (CV) Characterization.
John R. Lindsey, T. S. Kalkur
openaire   +2 more sources

Microstructures of Polysilicon

open access: yesMRS Proceedings, 1987
ABSTRACTSome typical microstructural studies of polycrystalline silicon using transmission electron microscopy (TEM) are described, including the application of this material for assisting TEM investigations themselves. Examples include oxidation and realignment of polysilicon thin films, the structure of polysilicon in EEPROM devices, polysilicon in ...
R. Sinclair   +3 more
openaire   +2 more sources

Polysilicon Integration

open access: yesMRS Proceedings, 1990
AbstractPolycrystalline silicon has found numerous applications in silicon integrated circuits, initially as a MOS gate material, and later for advanced isolation, capacitor electrodes, resistors, interconnect, bipolar emitters and bases, trench refill, doping sources, and the active material in thin film transistors. Integration of these techniques in
J. Ellul, I.D. Calder
openaire   +2 more sources

Polysilicon microstructures

open access: yes[1991] Proceedings. IEEE Micro Electro Mechanical Systems, 2002
The sacrificial etch technology for fabricating free-standing three-dimensional microstructures in polysilicon has been successfully implemented. A variety of techniques for reducing the intrinsic compressive stress have been employed in fabricating low ...
M.M. Farooqui, A.G.R. Evans
openaire   +2 more sources

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