Results 241 to 250 of about 113,392 (312)

Workflow for Design of Experiments‐Based Modeling of Species Transport and Growth Kinetics in GaN Hydride Vapor Phase Epitaxy

Advanced Engineering Materials, EarlyView.
A novel workflow for investigating hydride vapor phase epitaxy for GaN bulk crystal growth is proposed. It combines Design of experiments (DoE) with physical simulations of mass transport and crystal growth kinetics, serving as an intermediate step between DoE and experiments.
J. Tomkovič, G. Lukin, H. Torkashvand, A. Kerschbaum, M. Müller, S. Besendörfer, J. Heitmann, J. Friedrich   +7 more
wiley   +1 more source

Voltage regulation in PV-rich distribution networks: an edge pipelined intelligent computing approach. [PDF]

Commun Eng
Li C, Liu J, Liu Q, Li Y, Cao Y, Li Y.
europepmc   +1 more source

Soft Mechanical‐Electrical Logic Using Liquid Metal‐Filled 3D‐Printed Architectures

Advanced Engineering Materials, EarlyView.
We present 3D‐printed soft mechanical–electrical logic elements that use liquid metal–filled silicone tubes actuated by thermoplastic polyurethane/polylactic acid (TPU/PLA) architectures to produce Boolean operations. Complementary normally open and normally closed unit cells perform repeatable binary transitions and can be combined into more complex ...
Christoph Lehmann, Ryan Kalgreen, Laura M. Comella   +2 more
wiley   +1 more source

Action-factorized Rainbow deep Q-network with token Transformer for computation offloading in edge computing-enabled Internet of Ships. [PDF]

PLoS One
Zhang S, Yang H, Kim H, Shin I, Wu RMX.
europepmc   +1 more source

Direct Metal Deposition of Graphene–Ti28Nb35.4Zr Matrix Composites With Enhanced Mechanical, Corrosion, and Biocompatibility Properties for Bone Implants

Advanced Engineering Materials, EarlyView.
Graphene nanoplatelet (0.1 wt.%) reinforcement significantly enhances the performance of β Ti‐28Nb‐35.4Zr alloy. Grain refinement, reduced water contact angle, and improved surface characteristics promote osteoblast adhesion and complete surface coverage after 7 days.
Khurram Munir, Jixing Lin, Yuncang Li, Li Zhu, Paul F. A. Wright, Cuie Wen   +5 more
wiley   +1 more source

Spatial-Wavelength Multiplexing Error-Controlled Photonic Analog Computing System. [PDF]

Adv Sci (Weinh)
Zhu T, Zhu B, Zhang S, Li K, Wu X, Pi Y, Yan J, Chen D, Guo B, Xiao X, Wang L, Xu X, Xue X, Huang S, Cao Z, Yu S.   +15 more
europepmc   +1 more source

Toward Knowledge‐Based Workflows: A Semantic Approach to Atomistic Simulations for Mechanical and Thermodynamic Properties

Advanced Engineering Materials, EarlyView.
Knowledge‐based atomistic workflows are presented for mechanical and thermodynamic properties. By coupling modular simulations with ontology‐aligned metadata and provenance, Fe case studies on elastic behavior, defects, thermal properties, and Hall–Petch strengthening reveal how FAIR, queryable, and reusable simulation data can be generated. Mechanical
Abril Azócar Guzmán, Hoang‐Thien Luu, Sarath Menon, Tilmann Hickel, Nina Merkert, Stefan Sandfeld   +5 more
wiley   +1 more source

PdNeuRAM: forming-free, multi-bit Pd/HfO₂ ReRAM for energy-efficient neuromorphic computing. [PDF]

Commun Eng
Hua E, Spyrou T, Ahmadi M, Syed AM, Xun H, Braic L, Wehbe N, van der Veer E, Elatab N, Gebregiorgis A, Gaydadjiev G, Noheda B, Hamdioui S, Ishihara R, Abunahla H.   +14 more
europepmc   +1 more source

Cathodic Cage Plasma Deposition of Nanostructured Cu–Fe–Se Coatings on Poly(methyl Methacrylate)

Advanced Engineering Materials, EarlyView.
Nanostructured Cu–Fe–Se coatings are deposited on PMMA by a modified cathodic cage plasma process, enabling low‐temperature deposition on polymer substrates. A transition from discontinuous to compact morphology is observed with temperature, with optimal properties at 200°C, where improved CuFeSe2‐type bonding, lowest sheet resistance, and favorable ...
V. S. S. Sobrinho, M. Naeem, T. H. C. Costa, M. S. Libório, J. C. A. Queiroz, C. B. B. Luna, R. R. M. Sousa, P. S. Vieira, E. M. Araújo   +8 more
wiley   +1 more source

Long-run electricity consumption in computing: Exponential growth followed by stabilization due to efficiency gains. [PDF]

iScience
Pinto R, Brockway PE, Domingos T, Sousa T.   +3 more
europepmc   +1 more source