Results 101 to 110 of about 2,624 (204)
Cryogenic power electronics at megawatt-scale using a new type of press-pack IGBT [PDF]
, 2017 Lukas Graber +7 more
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A New Press Pack IGBT for High Reliable Applications With Short Circuit Failure Mode
, 2021 Heng Wang
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Hybrid half-bridge package for high voltage application [PDF]
3D power module structures allow for better cooling and lower parasitic inductances compared with the classical planar technology. In this paper, we present a hybrid half-bridge in a 3D packaging configuration, dedicated for high voltage application.
Castellazzi, Alberto +3 more
core
Reliability of Solid State Switches Used in High Current Discharge Applications [PDF]
, 2008 The presentation will give information about the long term reliability of semiconductor components which are used in high current, high di/dt discharge switches as they are used in systems for electro-magnetic forming.
Backlund, B., Welleman, A.
core
A Modeling Method of Press-Pack IGBT from Chip-level to Module-level [PDF]
, 2018 Shuai Sun +5 more
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Power Part of Reversible DC/DC Converter [PDF]
, 2015 Import 22/07/2015Diplomová práce se zabývá návrhem výkonové části reverzibilního DC/DC měniče. V teoretické části je nejprve proveden rozbor topologií pro obousměrný přenos elektrické energie v soustavách obnovitelných zdrojů s akumulačními systémy. Poté
Bohnjat, Martin
core
Redesign of the SNS Modulator H-Bridge for Utilization of Press-Pack IGBTs [PDF]
, 2008 Mark A Kemp +2 more
openalex
Research on Small Square PCB Rogowski Coil Measuring Transient Current in the Power Electronics Devices. [PDF]
Sensors (Basel), 2019 Jiao C, Zhang J, Zhao Z, Zhang Z, Fan Y.
europepmc +1 more source