An Improved Voltage Clamp Circuit Suitable for Accurate Measurement of the Conduction Loss of Power Electronic Devices. [PDF]
Sensors (Basel), 2021 Yu Q, Zhao Z, Sun P, Zhao B, Cai Y.
europepmc +1 more source
Printed Circuit Boards: The Layers' Functions for Electronic and Biomedical Engineering. [PDF]
Micromachines (Basel), 2022 Perdigones F, Quero JM.
europepmc +1 more source
Unified architecture of single-phase active power filter with battery interface for UPS operation [PDF]
, 2017 This paper presents a shunt active power filter with battery interface for uninterruptible power supply (UPS) operation. The proposed unified architecture is composed by a single-phase ac-dc converter from the power grid side and by a bidirectional ...
Afonso, José A. +4 more
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Power Cycle Testing of Press-Pack IGBT Chips [PDF]
In this thesis the power cycling capability of individual press-pack IGBT chips is investigated. Press-pack is a packaging technology used for power semiconductors.
Frank, Øyvind Bjerke
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Structure development and simulation of plug-in hybrid electric vehicle [PDF]
, 2013 Electric-drive vehicles (EDVs) have gained attention, especially in the context of growing concerns about global warming and energy security aspects associated with road transport.
Marozka, Aleh, Petrenko, Y. N.
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High reliable press packed IGBT
IEEJ Transactions on Electronics, Information and Systems, 1998 Hideo Matsuda +4 more
openaire +2 more sources
Power electronics - The key technology for Renewable Energy Systems [PDF]
, 2014 Blaabjerg, Frede, Ma, Ke, Yang, Yongheng
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Автономні перетворювачі та перетворювачі частоти: [PDF]
, 2017 Зміст видання відповідає освітній програмі підготовки бакалаврів зі спе- ціальності 141 Електроенергетика, електротехніка та електромеханіка та програмі дисципліни «Силові перетворювачі автоматизованих електроприводів».
Казачковский, Н. Н. +3 more
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Research on Small Square PCB Rogowski Coil Measuring Transient Current in the Power Electronics Devices. [PDF]
Sensors (Basel), 2019 Jiao C, Zhang J, Zhao Z, Zhang Z, Fan Y.
europepmc +1 more source
Hybrid half-bridge package for high voltage application [PDF]
3D power module structures allow for better cooling and lower parasitic inductances compared with the classical planar technology. In this paper, we present a hybrid half-bridge in a 3D packaging configuration, dedicated for high voltage application.
Castellazzi, Alberto +3 more
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