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In this study, the converter-structure based power loss and thermal models are developed for the medium voltage full-scale 3LANPC- VSC and 3L-HB-VSC utilizing press-pack IGBT-diode pairs and interfacing a 6MW wind turbine to a medium voltage grid.
Senturk, Osman S. +4 more
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Clamping Force Distribution within Press Pack IGBTs
, 2018 Erping Deng +3 more
openaire +2 more sources
Study on the Cauer Thermal Network Model of Press Pack IGBTs
IOP Conference Series: Materials Science and Engineering, 2018 Jinyuan Li +4 more
openaire +1 more source
Reliability Study and Modelling of IGBT Press-Pack Power Modules
2017 IEEE Applied Power Electronics Conference and Exposition (APEC), 2017 The IGBT press-pack provides low inductance and simple module stack for high power and high voltage applications. In this work, the reliability of IGBT Press-Pack power modules is experimentally tested under RBSOA conditions to investigate their limitation and current scalability.
Mark R Sweet, E M S Narayanan
exaly +4 more sources
IEEE Journal of Emerging and Selected Topics in Power Electronics, 2018 Nanosilver paste was used in this study as a die-attachment material for 3300-V power chips to eliminate the pressure contact of a press-pack power module.
Yunhui Mei, Guo-Quan Lu
exaly +2 more sources
Lifetime Prediction for Press Pack IGBT Device by Considering Fretting Wear Failure
Microelectronics Reliability, 2023 The reliability of the Press-Pack Insulated Gate Bipolar Transistor (PP-IGBT) device is important to guarantee the safety of modular multilevel converter (MMC).
Ran Yao, Wei Lai, Xianping Chen
exaly +2 more sources
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Microelectronics Reliability, 2017
Abstract The insulated gate bipolar transistor (IGBT) has been widely employed in such applications as alternate current motors and inverters for its lower driving power and lower on-state voltage. IGBT modules and press pack IGBTs are the most commonly used packaging for high-voltage and high-power-density applications.
Erping Deng +2 more
exaly +2 more sources
Abstract The insulated gate bipolar transistor (IGBT) has been widely employed in such applications as alternate current motors and inverters for its lower driving power and lower on-state voltage. IGBT modules and press pack IGBTs are the most commonly used packaging for high-voltage and high-power-density applications.
Erping Deng +2 more
exaly +2 more sources
Press Pack IGBTs for MVDC-breaker Applications
ISPS'23 Proceedings, 2023With the rising demand for higher power densities and robust system control, the need for using press pack IGBT (PPI) devices in medium voltage (MV) applications is also increasing. So far PPI manufacturers have majorly focused on devices with paralleling of IGBTs/diodes inside a single housing, that drives thousands of Amperes and is used for high ...
Koushik Sasmal +4 more
openaire +1 more source
Mechanical analysis of press-pack IGBTs
Microelectronics Reliability, 2012Abstract At present two packages for IGBT devices are available for applications in the MW power range: the bonded power module and the press-pack housing. Power modules have been object of extensive research including their thermo-mechanical characterisation under variable operating conditions and the analysis of their failure mechanisms.
Tilo Poller +4 more
openaire +1 more source