Results 71 to 80 of about 17,760,529 (147)
Design and Characteristic Analyss of Novel Press-Contact IGBT Module
机车电传动, 2013 Design of a novel pressure-contact IGBT module was stated. The advantages with respect to conventional IGBT modules were compared as well. The characteristics determined by static and dynamic tests demonstrated good performance and wide suitability for ...
DOU Ze-chun +4 more
doaj
An Improved Voltage Clamp Circuit Suitable for Accurate Measurement of the Conduction Loss of Power Electronic Devices. [PDF]
Sensors (Basel), 2021 Yu Q, Zhao Z, Sun P, Zhao B, Cai Y.
europepmc +1 more source
Printed Circuit Boards: The Layers' Functions for Electronic and Biomedical Engineering. [PDF]
Micromachines (Basel), 2022 Perdigones F, Quero JM.
europepmc +1 more source
, 2012 In this paper, a FEM (finite element method) based mechanical model for PP (press-pack) IGBTs (insulated gate bipolar transistors) is presented, which can be used to calculate the clamping force distribution among chips under various clamping conditions.
Hasmasan, Adrian Augustin +7 more
core +1 more source
FE-Modeling and Physical Testing of IGBTs for Press-Packaging
, 1998 The reliability of press-packed IGBTs strongly depends on the solutions adopted in terms of heat dissipation and thermo-mechanical stress management so as to guarantee satisfactory electrical and thermal contact conditions throughout the service life. In
M. Pasqualetti +6 more
core +2 more sources
Innovative press pack modules for high power IGBTs [PDF]
, 2001 A new IGBT press pack package was developed to meet increasingly challenging requirements for high power converters, such as in power systems applications.
Stefan Kaufmann +2 more
core +1 more source
Life Prediction Model for Press-Pack IGBT Module Based on Thermal Resistance Degradation
The contact interfaces of a press-pack insulated-gate bipolar transistor (PP-IGBT) module under fluctuating thermal stress will undergo minor friction and mutual sliding during service, which results in damage to the contact surface and a decline in the ...
Xiang Wang +6 more
core +1 more source
High reliable press packed IGBT
IEEJ Transactions on Electronics, Information and Systems, 1998 Hideo Matsuda +4 more
openaire +2 more sources
The influence of external conditions on the physical characteristics of Press-Pack IGBTs
Journal of Physics: Conference SeriesAbstract In order to solve the problem of unclear factors affecting the physical characteristics of Press-Pack IGBT devices, this paper explores the influence characteristics of the two main external conditions of fixture pressure and heat dissipation capacity on the physical parameters of Press-Pack IGBTs by building IGBT models with ...
Yujia Lu, Chaoqun Jiao
openaire +1 more source
Research on Small Square PCB Rogowski Coil Measuring Transient Current in the Power Electronics Devices. [PDF]
Sensors (Basel), 2019 Jiao C, Zhang J, Zhao Z, Zhang Z, Fan Y.
europepmc +1 more source