Results 71 to 80 of about 139 (129)
The application of multi-scale simulation in advanced electronic packaging. [PDF]
Fundam ResYu W +7 more
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Power Cycle Testing of Press-Pack IGBT Chips
, 2014 In this thesis the power cycling capability of individual press-pack IGBT chips is investigated. Press-pack is a packaging technology used for power semiconductors. For press-packs, both thermal and electrical contact to the semiconductor chip is obtained by the application of force on the package. Press-pack IGBTs is claimed by the manufacturers to be
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UEG Week 2019 Poster Presentations. [PDF]
United European Gastroenterol J, 2019 europepmc +1 more source
Clamping Force Distribution within Press Pack IGBTs
, 2018 Erping Deng +3 more
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Study on the Cauer Thermal Network Model of Press Pack IGBTs
IOP Conference Series: Materials Science and Engineering, 2018 Jinyuan Li +4 more
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Microelectronics Reliability, 2017
Abstract The insulated gate bipolar transistor (IGBT) has been widely employed in such applications as alternate current motors and inverters for its lower driving power and lower on-state voltage. IGBT modules and press pack IGBTs are the most commonly used packaging for high-voltage and high-power-density applications.
Erping Deng +2 more
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Abstract The insulated gate bipolar transistor (IGBT) has been widely employed in such applications as alternate current motors and inverters for its lower driving power and lower on-state voltage. IGBT modules and press pack IGBTs are the most commonly used packaging for high-voltage and high-power-density applications.
Erping Deng +2 more
exaly +2 more sources
Microelectronics Reliability, 2017
Abstract The accurate measurement of the junction-to-case thermal resistance of Insulated Gate Bipolar Transistor (IGBT) devices is notably important for manufacturers to optimize the internal structure of packaging in order to improve its reliability and for users to take full advantage of the devices.
Erping Deng +2 more
exaly +2 more sources
Abstract The accurate measurement of the junction-to-case thermal resistance of Insulated Gate Bipolar Transistor (IGBT) devices is notably important for manufacturers to optimize the internal structure of packaging in order to improve its reliability and for users to take full advantage of the devices.
Erping Deng +2 more
exaly +2 more sources
Development of Press-pack IGBT Chip for good SOA Capability
2019 3rd International Conference on Electronic Information Technology and Computer Engineering (EITCE), 2019In this paper, the advantages of press-pack IGBT in DC circuit breaker are introduced. According to the requirement of press package for IGBT chip, a cell structure with field oxide in active region was designed, and the optimal value of the field oxide length was obtained.
Junmin Wu, Mingchao Gao
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Press Pack IGBTs for MVDC-breaker Applications
ISPS'23 Proceedings, 2023With the rising demand for higher power densities and robust system control, the need for using press pack IGBT (PPI) devices in medium voltage (MV) applications is also increasing. So far PPI manufacturers have majorly focused on devices with paralleling of IGBTs/diodes inside a single housing, that drives thousands of Amperes and is used for high ...
Koushik Sasmal +4 more
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