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Cryogenic DC Circuit Breaker Based on High‐Power Press‐Pack IGBT

IET Electric Power Applications
The application of cryogenic and superconducting technologies could revolutionise aircraft electric propulsion systems by substantially increasing their power density and energy efficiency.
Zhongying Wang, Jiawen Xi, Xianwu Zeng, Stefan Steinhoff, Emelie Nilsson, Jean‐Francois Rouquette, Edwin Calderon, Ravi Kiran Surapaneni, Ludovic Ybanez, Xiaoze Pei   +9 more
doaj   +4 more sources

Electric Field Analysis of Press-Pack IGBTs [PDF]

E3S Web of Conferences, 2018
High voltage IGBT module is the ideal option for the VSC-HVDC power transmission application. At present, wire-bonded technology and press-pack technology are available packaging technologies for high voltage IGBT.
Xinling Tang, Yan Pan, Yanfang Chen, Pengyu Fu, Zhibin Zhao   +4 more
doaj   +2 more sources

Integrated Rogowski Coil Sensor for Press-Pack Insulated Gate Bipolar Transistor Chips [PDF]

Sensors, 2020
Recently, the press-pack insulated gate bipolar transistor (IGBT) has usually been used in direct current (DC) transmission. The press-pack IGBT (PPI) adopts a parallel layout of boss chips, and the currents of each chip will be uneven in the process of ...
Chaoqun Jiao, Zuoming Zhang, Zhibin Zhao, Xiumin Zhang   +3 more
doaj   +2 more sources

Mechanical Stress Analysis in High Power Press Pack IGBT

Zhongguo dianli, 2020
Mechanical stress is one of the key factors affecting the electrical characteristics, thermal characteristics and reliability of high-voltage high-power press-pack IGBT devices.
Xinling TANG, Zhongkang LIN, Xizi ZHANG, Shumin YAN, Bing SU, Liang WANG, Ronggang HAN, Hao SHI   +7 more
doaj   +2 more sources

Application of Silver Sintering Technology in Press-pack IGBTs

机车电传动, 2021
Silver sintering technology which has the characteristics of low temperature connection, low thermal resistance, low stress and high melting point, has gradually become the application trend of interface reliability-connection in insulated gate bipolar ...
Tingchang SHI, Han LI, Guiqin CHANG, Haihui LUO, Guozhong DONG, Guoyou LIU   +5 more
doaj   +1 more source

Power Cycle Testing of Press-Pack IGBT Chips [PDF]

, 2014
In this thesis the power cycling capability of individual press-pack IGBT chips is investigated. Press-pack is a packaging technology used for power semiconductors.
Frank, Øyvind Bjerke
core   +3 more sources

Inductance extraction of Press-Pack IGBT by Considering Displacement Current [PDF]

E3S Web of Conferences, 2018
Taking the displacement current generated by charges accumulation into consideration, this paper presents a inductance extraction method for press-pack IGBT where conductor might not form a closed loop in simulation.
Li Jinyuan, Chen Zhongyuan, Zhang Lei, NI Chouwei, ZHAO Zhibin   +4 more
doaj   +2 more sources

Accelerate Aging Test Method for Press-Pack IGBT Power Module

Zhongguo dianli, 2022
Since reliability test of Press-pack IGBT (PPI) still not been researched enough, based on its application in industry, A cycle aging test methods aimed at VSC-HVDC power unit are proposed.
Biaojun LI, Haiyang CHU, Zhifa ZHUANG, Jun WEN   +3 more
doaj   +2 more sources

Study of Thermal Characteristics on Press-pack IGBT Modules

机车电传动, 2013
Thermal characteristics of press-pack IGBT modules were studied by utilizing three kinds of approaches. The thermal model was constructed, and static thermal resistance was analyzed by computation and finite-element simulation, as well as experimental ...
DOU Ze-chun, XIN Lan-yuan, LIU Guo-you, HUANG Rong, XU Ning-hua, WU Yi-bo   +5 more
doaj   +1 more source

Review on Failure Mode and Mechanism of Press-Pack IGBT and Thyristor Devices

Zhongguo dianli, 2023
High voltage and large capacity press-pack insulated gate bipolar transistor (IGBT) devices and thyristor devices are the core devices in high-voltage DC transmission projects, which are of great significance for the efficient use of energy.
Haoze LUO, Zhong CHEN, Wei YANG, Jia XIE, Di HU, Weiping GUAN   +5 more
doaj   +1 more source