Results 1 to 10 of about 17,691,121 (147)
Electric Field Analysis of Press-Pack IGBTs [PDF]
E3S Web of Conferences, 2017 High voltage IGBT module is the ideal option for the VSC-HVDC power transmission application. At present, wire-bonded technology and press-pack technology are available packaging technologies for high voltage IGBT. The press-pack IGBTs have such advantages as low inductance, low thermal impedance and short circuit failure mode than the wire-bonded IGBT
Xinling Tang +4 more
doaj +4 more sources
Reliability Study and Modelling of IGBT Press-Pack Power Modules
2017 IEEE Applied Power Electronics Conference and Exposition (APEC), 2017 The IGBT press-pack provides low inductance and simple module stack for high power and high voltage applications. In this work, the reliability of IGBT Press-Pack power modules is experimentally tested under RBSOA conditions to investigate their limitation and current scalability.
Mark R Sweet, E M S Narayanan
exaly +4 more sources
Application of Silver Sintering Technology in Press-pack IGBTs
机车电传动, 2021 Silver sintering technology which has the characteristics of low temperature connection, low thermal resistance, low stress and high melting point, has gradually become the application trend of interface reliability-connection in insulated gate bipolar transistors(IGBT). The mechanism of silver sintering technology, and the structure of press-pack IGBT
Tingchang SHI +5 more
doaj +4 more sources
Study of Thermal Characteristics on Press-pack IGBT Modules
机车电传动, 2013 Thermal characteristics of press-pack IGBT modules were studied by utilizing three kinds of approaches. The thermal model was constructed, and static thermal resistance was analyzed by computation and finite-element simulation, as well as experimental measuring approach was applied based on the calibration of temperature parameters.
DOU Ze-chun +5 more
doaj +4 more sources
Press-pack IGBTs for HVDC and FACTs
CSEE Journal of Power and Energy Systems, 2017 The popularity of insulated gate bipolar transistors (IGBTs) for use in high-voltage direct current (HVDC) transmission and flexible AC transmission systems (FACTS) is increasing. Unfortunately, for these applications wire-bond IGBT technology has a number of shortcomings, such as insufficient current ratings for the most powerful schemes, and ...
Robin Simpson +5 more
openaire +1 more source
Cryogenic Power Electronics: Press-Pack IGBT Modules [PDF]
IOP Conference Series: Materials Science and Engineering, 2020 Abstract With the goal of enabling high-power-density cryogenic power converter technology and superconducting power applications for future aircraft and shipboard power systems, the dynamic and static performances of a press-pack IGBT module (T0160NB45A) at ambient and cryogenic conditions are reported. Compared to the wire-bond IGBT’s,
C Park +5 more
openaire +1 more source
Study on the issue of electric field concentration in submodule of press pack IGBTs
2017 Sixth Asia-Pacific Conference on Antennas and Propagation (APCAP), 2017 There is a phenomenon that the chips of press pack IGBT (Insulated Gate Bipolar Transistor) meet the requirements of withstand voltage test, but ignition sometimes occurred in the submodules of the same kind of press pack IGBT during the test. In response to this situation, this paper firstly analyzed that the difference of submodule frame lead to ...
Jinyuan Li +4 more
openaire +1 more source
Power Electronics Revolutionized: A Comprehensive Analysis of Emerging Wide and Ultrawide Bandgap Devices. [PDF]
Micromachines (Basel), 2023 Rafin SMSH +5 more
europepmc +1 more source
A Condition Evaluation Simplified Method for Traction Converter Power Module Based on Operating Interval Segmentation. [PDF]
Sensors (Basel), 2023 Wang L, Zhou M, Dongye Z, Sha Y, Chen J.
europepmc +1 more source
Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling. [PDF]
Micromachines (Basel), 2022 Tan L +6 more
europepmc +1 more source