Results 41 to 50 of about 139 (128)
IET Power Electronics, Volume 19, Issue 1, January/December 2026.This work investigates the displacement amplitude of the contact surfaces between the Si chip and the Mo emitter plate of a PP‐IGBT module during power cycling on the basis of experimental measurements, as well as the effects of loading conditions such as the load current, switching time and normal load on the displacement amplitude.
Tong An +5 more
wiley +1 more source
The Journal of Engineering, 2019 Modular multi-level converter (MMC) with press-packing IGBT devices is the popular and key equipment of VSC-HVDC system, its reliability is directly related to the equipment safe operation.
Li Hui +6 more
doaj +1 more source
3D Lumped Thermal Model for Compliant Press‐Pack IGBT Submodule in MMC
IET Power Electronics, Volume 19, Issue 1, January/December 2026.We present a 3D lumped thermal model for compliant press‐pack IGBT submodules in MMCs. The model accounts for double‐sided cooling and thermal coupling, achieving high accuracy and efficiency, making it suitable for real‐time condition monitoring. ABSTRACT The compliant press‐pack IGBT is widely used in modular multilevel converters (MMCs).
Shuguo Gao +5 more
wiley +1 more source
IET Power Electronics, Volume 19, Issue 1, January/December 2026.Bond wire lift‐off is one of the primary failure modes in power modules and early identification of its degradation state and lift‐off ratio is crucial for ensuring reliable operation. Conventional methods have limitations in quantifying early‐stage lift‐off defects.
Xuanyi Liu +6 more
wiley +1 more source
Thermal Design and Simulation of High Power Press-pack IGBT Module
Kongzhi Yu Xinxi Jishu, 2016 With the improvement of packaging power level of IGBT module, power density and operating temperature on chip will rise, which may lead to an increasing affect of thermal stress on long-term reliability of the device.
XIAO Hongxiu, DOU Zechun, PENG Yongdian
doaj
IET Power Electronics, Volume 19, Issue 1, January/December 2026.This paper proposes a novel on‐state voltage measurement circuit (OVMC) for accurate online Vce extraction. By adopting a power‐balanced differential diode topology, the proposed circuit minimises the Vce measurement error. The OVMC is applied to the Buck operating condition to monitor the junction temperature of chips inside a press‐pack IGBT ...
Yihe Zhang +7 more
wiley +1 more source
IET Power Electronics, Volume 19, Issue 1, January/December 2026.A sensor structure design scheme is proposed in this work by establishing the transmission characteristic model, which quantitatively calculates geometric parameters and sensitivity relationships between tunnel magneto‐resistance (TMR) and Rogowski coils.
Ze Zhou +4 more
wiley +1 more source
Busbar Interference Correction for Non‐Invasive Current Distribution Sensing in Press‐Pack IGBTs
IET Power Electronics, Volume 19, Issue 1, January/December 2026.This paper proposes a busbar‐interference correction method for non‐invasive sensing of internal current distribution in press‐pack IGBTs under converter‐valve conditions. By using state‐differential magnetic‐field reconstruction, the method suppresses common‐mode interference from side busbars and improves current‐offset direction identification ...
Yong Yang +6 more
wiley +1 more source
Heat Dissipation Optimisation Design of Pole‐Changing Motor Driver
International Journal of Energy Research, Volume 2026, Issue 1, 2026.Current research focuses primarily on studying the heat dissipation modes of drive devices in various configurations to optimise the energy consumption of cooling systems in new energy vehicles and improve their driving range; however, the overall power consumption is not yet fully grasped or controlled.
Yangfeng Cao +4 more
wiley +1 more source
International Transactions on Electrical Energy Systems, Volume 2026, Issue 1, 2026.The South African rail sector is a key contributor to the national economy, boosting gross domestic product (GDP) and creating jobs. However, serious malfunctions often jeopardize the reliability of locomotives such as the Class 8E locomotive, leading to lost output and longer lead times.
Rofhiwa C. Mufamadi +3 more
wiley +1 more source