Results 21 to 30 of about 4,301 (207)
Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior [PDF]
, 2017 Insulated gate bipolar transistor (IGBT) modules, which can fail to stable short-circuit mode, have major applications in electricity network-related fields.
Corfield, Martin +3 more
core +1 more source
A Review of Thermal Design for IGBT Module
Zhongguo dianli, 2020 In this paper, the thermal characteristics and thermal design of IGBT module are reviewed. Firstly, the thermal network model and its dependence on the packaging material’s thermal performance and dimensions are addressed.
Guoyou LIU +5 more
doaj +1 more source
IEEE Access, 2023 Stress imbalance significantly affects the performance of a press-pack insulated gate bipolar transistor (IGBT). Time-variant loads and conditions lead to the stress fluctuations, exacerbating the impacts.
Hangyang Li +6 more
doaj +1 more source
The Journal of Engineering, 2019 Press-pack insulated gate bipolar transistor (IGBT) device is the key component in the voltage source converter high voltage direct current (VSC-HVDC) due the advantage of the short-circuit failure.
Ran Yao +9 more
doaj +1 more source
Thermal Design of Power Electronic Circuits [PDF]
, 2016 The heart of every switched mode converter consists of several switching semiconductor elements. Due to their non-ideal behaviour there are ON state and switching losses heating up the silicon chip.
Künzi, R.
core +3 more sources
High-power active devices [PDF]
, 2006 Very high-power (HP) electronics represents a small part of the electronics market. In semiconductor terms, HP represents a world device market of 600 million euros out of a total 200 billion euros for all semiconductors—a mere 0.3 per cent. At the multi-
Carroll, E
core +1 more source
Utility applications of power electronics in Japan [PDF]
, 1997 Since the late 1950s, power electronics has been developing by leaps and bounds without saturation into the key technology essential to modern society and human life, as well as to electrical engineering.
Akagi, Hirofumi
core +1 more source
Research on Long-term Reliability of Silver Sintered Press-Pack IGBT Modules
Power Electronic Devices and Components, 2022 Owing to the advantages of short-circuit failure mode, double-sided heat dissipation, and low thermal resistance, press-pack insulated gate bipolar transistors (PP-IGBTs) are widely used in high-power-density applications, such as high-voltage direct ...
Renkuan Liu +8 more
doaj +1 more source
Electro-thermo-mechanical modelling and analysis of the Press Pack Diode in Power Electronics [PDF]
, 2015 This paper details a finite element modelling approach of the press pack assembly process for a diode in a power electronic module. Molybdenum and aluminum graphite have been investigated as suitable materials for the contact pad.
Alatise, O. +4 more
core +1 more source
Enabling high reliability power modules : a multidisciplinary task [PDF]
, 2016 Reliability of power electronic systems is a major concern for application engineers in the automotive and power system sectors. Power electronic modules are one of the main sources of failure in wind energy conversion systems.
Alatise, Olayiwola M. +10 more
core +1 more source