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Cryogenic DC Circuit Breaker Based on High‐Power Press‐Pack IGBT
IET Electric Power ApplicationsThe application of cryogenic and superconducting technologies could revolutionise aircraft electric propulsion systems by substantially increasing their power density and energy efficiency.
Zhongying Wang +9 more
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Electric Field Analysis of Press-Pack IGBTs [PDF]
E3S Web of Conferences, 2018 High voltage IGBT module is the ideal option for the VSC-HVDC power transmission application. At present, wire-bonded technology and press-pack technology are available packaging technologies for high voltage IGBT.
Xinling Tang +4 more
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Integrated Rogowski Coil Sensor for Press-Pack Insulated Gate Bipolar Transistor Chips [PDF]
Sensors, 2020 Recently, the press-pack insulated gate bipolar transistor (IGBT) has usually been used in direct current (DC) transmission. The press-pack IGBT (PPI) adopts a parallel layout of boss chips, and the currents of each chip will be uneven in the process of ...
Chaoqun Jiao +3 more
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Mechanical Stress Analysis in High Power Press Pack IGBT
Zhongguo dianli, 2020 Mechanical stress is one of the key factors affecting the electrical characteristics, thermal characteristics and reliability of high-voltage high-power press-pack IGBT devices.
Xinling TANG +7 more
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Application of Silver Sintering Technology in Press-pack IGBTs
机车电传动, 2021 Silver sintering technology which has the characteristics of low temperature connection, low thermal resistance, low stress and high melting point, has gradually become the application trend of interface reliability-connection in insulated gate bipolar ...
Tingchang SHI +5 more
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Inductance extraction of Press-Pack IGBT by Considering Displacement Current [PDF]
E3S Web of Conferences, 2018 Taking the displacement current generated by charges accumulation into consideration, this paper presents a inductance extraction method for press-pack IGBT where conductor might not form a closed loop in simulation.
Li Jinyuan +4 more
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Power Cycle Testing of Press-Pack IGBT Chips [PDF]
, 2014 In this thesis the power cycling capability of individual press-pack IGBT chips is investigated. Press-pack is a packaging technology used for power semiconductors. For press-packs, both thermal and electrical contact to the semiconductor chip is obtained by the application of force on the package. Press-pack IGBTs is claimed by the manufacturers to be
Frank, Øyvind Bjerke
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Accelerate Aging Test Method for Press-Pack IGBT Power Module
Zhongguo dianli, 2022 Since reliability test of Press-pack IGBT (PPI) still not been researched enough, based on its application in industry, A cycle aging test methods aimed at VSC-HVDC power unit are proposed.
Biaojun LI +3 more
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Study of Thermal Characteristics on Press-pack IGBT Modules
机车电传动, 2013 Thermal characteristics of press-pack IGBT modules were studied by utilizing three kinds of approaches. The thermal model was constructed, and static thermal resistance was analyzed by computation and finite-element simulation, as well as experimental ...
DOU Ze-chun +5 more
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Review on Failure Mode and Mechanism of Press-Pack IGBT and Thyristor Devices
Zhongguo dianli, 2023 High voltage and large capacity press-pack insulated gate bipolar transistor (IGBT) devices and thyristor devices are the core devices in high-voltage DC transmission projects, which are of great significance for the efficient use of energy.
Haoze LUO +5 more
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