Results 41 to 50 of about 2,388 (173)

A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications [PDF]

open access: yes, 2017
This paper details a modeling and experimental assessment of the packaging process for a silicon carbide Schottky diode using pressure contacts. The work detailed in this paper is original, as it applies a combined electrothermomechanical modeling ...
Alatise, Olawiwola   +4 more
core   +2 more sources

Weibull‐Neural Network Framework for Wind Turbine Lifetime Monitoring and Disturbance Identification

open access: yesWind Energy, Volume 29, Issue 4, April 2026.
ABSTRACT Wind turbines are vital for sustainable energy, yet their reliability under diverse operational and environmental conditions remains a challenge, often leading to costly failures. This study presents a novel Weibull‐Neural Network Framework to enhance wind turbine lifetime monitoring by estimating reliability (R(t)) and mean residual life (MRL)
Fatemeh Kiadaliry   +2 more
wiley   +1 more source

An IEGT Model for Analyzing the High Current Turn-off Characteristics in DC Circuit Breaker Applications

open access: yesIEEE Access, 2020
The direct current (DC) circuit breaker based on semiconductor power devices is one of the critical components in multiterminal flexible high voltage DC transmission technology.
Xin Liu   +3 more
doaj   +1 more source

Integrated half-bridge switch using 70-μm-thin devices and hollow interconnects [PDF]

open access: yes, 2015
An application-oriented integration concept for a half-bridge switch assembly has been developed based on the latest generation 70- μm-thin insulated gate bipolar transistors and diodes, which are rated at 600 V/200 A. This paper addresses the design and
Castellazzi, Alberto   +3 more
core   +2 more sources

Multiterminal High‐Voltage Direct Current Projects: A Comprehensive Assessment and Future Prospects

open access: yesHigh Voltage, Volume 11, Issue 2, Page 317-344, April 2026.
ABSTRACT Multiterminal high‐voltage direct current (MT‐HVDC) systems are an important part of modern power systems, addressing the need for bulk power delivery and efficient renewable energy integration. This paper provides a comprehensive overview of recent advances in MT‐HVDC technology, including launched projects and ongoing initiatives.
Mohammad Hossein Mousavi   +3 more
wiley   +1 more source

Power outage detection methods for theoperation of a shunt active power flter as energy backup system [PDF]

open access: yes, 2014
This paper presents the study of power outage detection methods that can be applied to a Shunt Active Power Filter (SAPF) with energy backup capability.
A. Moschitta   +5 more
core   +3 more sources

Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics

open access: yesAdvanced Science, Volume 13, Issue 17, 23 March 2026.
This review surveys emerging materials for thermal management in advanced electronic packaging, with emphasis on ceramic substrates and thermal interface materials. Multiscale simulations and mechanistic analyses are highlighted, alongside the emerging role of artificial intelligence in predicting thermal properties and guiding design, offering ...
Yongjun Huo   +11 more
wiley   +1 more source

Comparison of power electronics lifetime between vertical- and horizontal-axis wind turbines [PDF]

open access: yes, 2016
A comparison has been made of the power electronics lifetime for 5MW horizontal- and vertical-axis wind turbines, based on dynamic models supplied with generated wind speed time series.
Giles, Alex   +2 more
core   +2 more sources

Comparison of Fuzzy Logic and PID Control in H‐Bridge Inverter: Performance Analysis and Response Optimization

open access: yesEngineering Reports, Volume 8, Issue 2, February 2026.
Under identical conditions, we benchmark PID against Fuzzy‐Logic control for a single‐phase H‐bridge inverter. FLC achieves faster rise/settling with lower THD and better disturbance rejection than tuned PID while requiring explicit rule design—offering a reproducible baseline and deployment guidance for power‐quality‐constrained inverter applications.
Baraa Taha   +4 more
wiley   +1 more source

Optimized Design in Current, Temperature and Stress Distributions for Paralleled Chips in Press-Pack IGBT Modules

open access: yesCSEE Journal of Power and Energy Systems
In a press-pack insulated gate bipolar transistor (IGBT), a compact packaging structure forms a strong electromagnetic coupling, thermal coupling, and stress coupling, threatening current sharing, temperature sharing, and stress sharing of paralleled ...
Lubin Han, Lin Liang, Yong Kang
doaj   +1 more source

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