Results 61 to 70 of about 2,388 (173)

Heat Dissipation Optimisation Design of Pole‐Changing Motor Driver

open access: yesInternational Journal of Energy Research, Volume 2026, Issue 1, 2026.
Current research focuses primarily on studying the heat dissipation modes of drive devices in various configurations to optimise the energy consumption of cooling systems in new energy vehicles and improve their driving range; however, the overall power consumption is not yet fully grasped or controlled.
Yangfeng Cao   +4 more
wiley   +1 more source

Reliability modelling and analysis on MMC for VSC-HVDC by considering the press-pack IGBT and capacitors failure

open access: yesThe Journal of Engineering, 2019
Modular multi-level converter (MMC) with press-packing IGBT devices is the popular and key equipment of VSC-HVDC system, its reliability is directly related to the equipment safe operation.
Li Hui   +6 more
doaj   +1 more source

Regenerative braking using buckboost converter [PDF]

open access: yes, 2014
A Buck Boost converter circuit has been designed and simulated to drive a dc motor for an electric vehicle. The design consists of an IGBT Buck-Boost converter, the battery pack in the Buck side and a capacitor in the Boost side. The main battery has the
Satapathy, P P
core  

Comparison of Neuro‐Fuzzy and Neural Network Techniques for Estimating the Line Voltage of 8E Electrical Locomotives

open access: yesInternational Transactions on Electrical Energy Systems, Volume 2026, Issue 1, 2026.
The South African rail sector is a key contributor to the national economy, boosting gross domestic product (GDP) and creating jobs. However, serious malfunctions often jeopardize the reliability of locomotives such as the Class 8E locomotive, leading to lost output and longer lead times.
Rofhiwa C. Mufamadi   +3 more
wiley   +1 more source

Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects [PDF]

open access: yes, 2014
A stacked substrate–chip–bump–chip–substrate assembly has been demonstrated in the construction of power switch modules with high power density and good electrical performance.
Castellazzi, Alberto   +5 more
core   +3 more sources

Life Cycle Profile Development for Product Reliability Assessment

open access: yesQuality and Reliability Engineering International, Volume 41, Issue 7, Page 3054-3064, November 2025.
ABSTRACT The life cycle profile (LCP) is a catalog of all the expected loads a given product experiences across its lifetime, from the completion of product manufacture to the end of operation and removal from service. This paper outlines a procedure for developing an LCP, including cataloging estimates of the loads the product experiences over its ...
Abhishek Ram, Diganta Das
wiley   +1 more source

High-throughput DBC-assembled IGBT screening for power module [PDF]

open access: yes, 2014
High-throughput DBC-assembled IGBT screening equipment for a production line is under development in order to prevent early failure of power modules.
Noda Ryuzo   +4 more
core   +1 more source

Edge‐Free Graphene‐Derived Mesoporous Carbon for High‐Voltage Supercapacitors

open access: yesSmall Structures, Volume 6, Issue 10, October 2025.
A defect‐minimized, edge‐free graphene‐derived mesoporous carbon (GMC) is synthesized via a rapid carbothermal shock process. The GMC shows ultrahigh surface area, high conductivity (≈9000 S m−1), and excellent electrochemical performance (≈250 F g−1 , 10,000+ cycles at 4.4 V), offering a scalable path to high‐voltage energy storage.
Mitesh Ganpat Mapari   +4 more
wiley   +1 more source

Thermal Design and Simulation of High Power Press-pack IGBT Module

open access: yesKongzhi Yu Xinxi Jishu, 2016
With the improvement of packaging power level of IGBT module, power density and operating temperature on chip will rise, which may lead to an increasing affect of thermal stress on long-term reliability of the device.
XIAO Hongxiu, DOU Zechun, PENG Yongdian
doaj  

Recent Advanced Ultra‐Wide Bandgap β‐Ga2O3 Material and Device Technologies

open access: yesAdvanced Electronic Materials, Volume 11, Issue 1, January 2025.
The advanced ultra‐wide bandgap semiconductor material β‐Ga2O3 is highly favored for its exceptional material properties. This sudy provides a comprehensive review of its developments in areas such as materials, power devices, and RF devices. The current status of its commercialization process is outlined, along with an analysis of the challenges it is
Sihan Sun   +5 more
wiley   +1 more source

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