Results 61 to 70 of about 2,388 (173)
Heat Dissipation Optimisation Design of Pole‐Changing Motor Driver
Current research focuses primarily on studying the heat dissipation modes of drive devices in various configurations to optimise the energy consumption of cooling systems in new energy vehicles and improve their driving range; however, the overall power consumption is not yet fully grasped or controlled.
Yangfeng Cao +4 more
wiley +1 more source
Modular multi-level converter (MMC) with press-packing IGBT devices is the popular and key equipment of VSC-HVDC system, its reliability is directly related to the equipment safe operation.
Li Hui +6 more
doaj +1 more source
Regenerative braking using buckboost converter [PDF]
A Buck Boost converter circuit has been designed and simulated to drive a dc motor for an electric vehicle. The design consists of an IGBT Buck-Boost converter, the battery pack in the Buck side and a capacitor in the Boost side. The main battery has the
Satapathy, P P
core
The South African rail sector is a key contributor to the national economy, boosting gross domestic product (GDP) and creating jobs. However, serious malfunctions often jeopardize the reliability of locomotives such as the Class 8E locomotive, leading to lost output and longer lead times.
Rofhiwa C. Mufamadi +3 more
wiley +1 more source
Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects [PDF]
A stacked substrate–chip–bump–chip–substrate assembly has been demonstrated in the construction of power switch modules with high power density and good electrical performance.
Castellazzi, Alberto +5 more
core +3 more sources
Life Cycle Profile Development for Product Reliability Assessment
ABSTRACT The life cycle profile (LCP) is a catalog of all the expected loads a given product experiences across its lifetime, from the completion of product manufacture to the end of operation and removal from service. This paper outlines a procedure for developing an LCP, including cataloging estimates of the loads the product experiences over its ...
Abhishek Ram, Diganta Das
wiley +1 more source
High-throughput DBC-assembled IGBT screening for power module [PDF]
High-throughput DBC-assembled IGBT screening equipment for a production line is under development in order to prevent early failure of power modules.
Noda Ryuzo +4 more
core +1 more source
Edge‐Free Graphene‐Derived Mesoporous Carbon for High‐Voltage Supercapacitors
A defect‐minimized, edge‐free graphene‐derived mesoporous carbon (GMC) is synthesized via a rapid carbothermal shock process. The GMC shows ultrahigh surface area, high conductivity (≈9000 S m−1), and excellent electrochemical performance (≈250 F g−1 , 10,000+ cycles at 4.4 V), offering a scalable path to high‐voltage energy storage.
Mitesh Ganpat Mapari +4 more
wiley +1 more source
Thermal Design and Simulation of High Power Press-pack IGBT Module
With the improvement of packaging power level of IGBT module, power density and operating temperature on chip will rise, which may lead to an increasing affect of thermal stress on long-term reliability of the device.
XIAO Hongxiu, DOU Zechun, PENG Yongdian
doaj
Recent Advanced Ultra‐Wide Bandgap β‐Ga2O3 Material and Device Technologies
The advanced ultra‐wide bandgap semiconductor material β‐Ga2O3 is highly favored for its exceptional material properties. This sudy provides a comprehensive review of its developments in areas such as materials, power devices, and RF devices. The current status of its commercialization process is outlined, along with an analysis of the challenges it is
Sihan Sun +5 more
wiley +1 more source

