Results 51 to 60 of about 139 (129)
Study on the issue of electric field concentration in submodule of press pack IGBTs
There is a phenomenon that the chips of press pack IGBT (Insulated Gate Bipolar Transistor) meet the requirements of withstand voltage test, but ignition sometimes occurred in the submodules of the same kind of press pack IGBT during the test. In response to this situation, this paper firstly analyzed that the difference of submodule frame lead to ...
Jinyuan Li +4 more
openaire +1 more source
Life Cycle Profile Development for Product Reliability Assessment
ABSTRACT The life cycle profile (LCP) is a catalog of all the expected loads a given product experiences across its lifetime, from the completion of product manufacture to the end of operation and removal from service. This paper outlines a procedure for developing an LCP, including cataloging estimates of the loads the product experiences over its ...
Abhishek Ram, Diganta Das
wiley +1 more source
Design and Key Technologies of High-power Press-pack IGBT Device
It presented the advantages of high-power press-pack IGBT device with respect to conventional soldering device. In the aspect of device design, insulation and blocking failure mechanism were analyzed as well as optimized solution which increasing the ...
DOU Zechun +5 more
doaj
A Controllable Line-Commutated Converter (CLCC) is a novel piece of equipment for enhancing the commutation failure resistance of High-Voltage Direct Current (HVDC) transmission systems.
Mengting Yang, Zhaoxin Du, Wenbin Zhao
doaj +1 more source
Research on the Press-pack IGBT with High SCSOA
DC breaker is one of the main equipment of HVDC system converter station. As an essential component of DC breaker, the electrical performance and reliability of the press-pack IGBT (insulated gate bipolar transistor) are particularly important.
LENG Guoqing +5 more
doaj
The high‐power press‐pack insulate gate bipolar transistor (IGBT) is the core device of a high‐voltage converter. The current sharing and aging characteristics of many parallel chips in IGBT are critical issues regarding its operational reliability.
Litong Wang +5 more
doaj +1 more source
Power Electronics Revolutionized: A Comprehensive Analysis of Emerging Wide and Ultrawide Bandgap Devices. [PDF]
Rafin SMSH +5 more
europepmc +1 more source
A Condition Evaluation Simplified Method for Traction Converter Power Module Based on Operating Interval Segmentation. [PDF]
Wang L, Zhou M, Dongye Z, Sha Y, Chen J.
europepmc +1 more source
Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling. [PDF]
Tan L +6 more
europepmc +1 more source
Design and Characteristic Analyss of Novel Press-Contact IGBT Module
Design of a novel pressure-contact IGBT module was stated. The advantages with respect to conventional IGBT modules were compared as well. The characteristics determined by static and dynamic tests demonstrated good performance and wide suitability for ...
DOU Ze-chun +4 more
doaj

