Results 51 to 60 of about 2,388 (173)

Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules [PDF]

, 2016
SiC is a wide bandgap semiconductor with better electrothermal properties than silicon, including higher temperature of operation, higher breakdown voltage, lower losses and the ability to switch at higher frequencies.
A. Castellazzi, A.M. Aliyu, Banu, Busca, GopiReddy, Herold, J. Ortiz Gonzalez, L. Ran, Lutz, O. Alatise, P. Mawby, Rajaguru, Rencz, Sugawara, Szekely, Székely, Yovanovich   +16 more
core   +2 more sources

Beyond Conventional Cooling: Advanced Micro/Nanostructures for Managing Extreme Heat Flux

Advanced Materials, Volume 38, Issue 5, 22 January 2026.
This review examines the design, application, and manufacturing of biomimetic or engineered micro/nanostructures for managing high heat‐flux in multi‐level electronics by enhancing conductive, convective, phase‐changing, and radiative heat transfer mechanisms, highlighting their potential for efficient, targeted thermal management, and future prospects.
Yuankun Zhang, Huajie Li, Yuhang Zhou, Jun Ma, Keng‐Te Lin, Han Lin, Chunsheng Guo, Baohua Jia   +7 more
wiley   +1 more source

High Power Press-pack IGBT and Its Application in Pulsed Magnetic-field Generator

Kongzhi Yu Xinxi Jishu, 2017
In some special field of high voltage and high current, the application of conventional IGBT will increase the complexity of system structure and difficulties of control. Therefore, this paper introduced a new type of power press-pack IGBT device.
CHEN Jun, WAN Chaoqun, CHEN Yan, LI Xiaolin   +3 more
doaj  

A new symmetric modular eleven‐level inverter using single and double source unit for low voltage applications with reduced number of switches

IET Power Electronics, Volume 19, Issue 1, January/December 2026.
This study introduces a new modular multilevel inverter that can produce five levels of positive voltage using only six power switches and five DC voltage sources. The basic unit is composed of a single‐ and double‐source (SDS) unit. SDS reduces the number of power electronic components, such as the insulated gate bipolar transistors, freewheeling ...
Naser Fakhri, Sara Laali, Mohammad Salay Naderi, Hossein Rahimi, Saeid Gholami Farkoush   +4 more
wiley   +1 more source

Design, analysis, and testing of PP-IGBT-based submodule stack for the MMC VSC HVDC with 3000 A DC bus current

The Journal of Engineering, 2018
Voltage sourced converter (VSC) high-voltage direct current (HVDC) is moving to higher DC voltage and capacity, such as ±500 kV/3000 MW and ±800 kV/5000 MW for a single converter, which will bring tremendous challenges for converter submodule design ...
Huifeng Chen, Frank Wakeman, Julian Pitman, Gangru Li   +3 more
doaj   +1 more source

Improved reliability of planar power interconnect with ceramic-based structure [PDF]

, 2018
This paper proposes an advanced Si3N4 ceramic-based structure with through vias designed and filled with brazing alloy as a reliable interconnect solution in planar power modules. Finite element (FE) modeling and simulation were first used to predict the
Corfield, Martin, Dai, Jingru, Huang, Zhengren, Johnson, Christopher Mark, Li, Jianfeng, Liu, Xuejian, Liu, Yan, Zhang, Hui   +7 more
core   +1 more source

Experimental Study of the Fretting Amplitude of the Contact Surface in a PP‐IGBT Module During Power Cycling

IET Power Electronics, Volume 19, Issue 1, January/December 2026.
This work investigates the displacement amplitude of the contact surfaces between the Si chip and the Mo emitter plate of a PP‐IGBT module during power cycling on the basis of experimental measurements, as well as the effects of loading conditions such as the load current, switching time and normal load on the displacement amplitude.
Tong An, Yunzhi Qi, Xueheng Zheng, Fei Qin, Xiang Wang, Jianqiang Li   +5 more
wiley   +1 more source

Modular Multilevel Converter Modelling, Control and Analysis under Grid Frequency Deviations [PDF]

, 2012
A tool for component sizing for MMCs has been developed and tested through simulations in PLECS. The steady-state behaviour under grid frequency deviations — interesting for offshore wind farm connections — has been analysed, providing insights in MMC ...
da Silva, Rodrigo, Helle, Lars, Kjaer, Philip Carne, Sztykiel, Michal, Teodorescu, Remus, Zeni, Lorenzo   +5 more
core   +1 more source

3D Lumped Thermal Model for Compliant Press‐Pack IGBT Submodule in MMC

IET Power Electronics, Volume 19, Issue 1, January/December 2026.
We present a 3D lumped thermal model for compliant press‐pack IGBT submodules in MMCs. The model accounts for double‐sided cooling and thermal coupling, achieving high accuracy and efficiency, making it suitable for real‐time condition monitoring. ABSTRACT The compliant press‐pack IGBT is widely used in modular multilevel converters (MMCs).
Shuguo Gao, Haoyu Liu, Ruiyi Fan, Lingyu Zhu, Jinxi Li, Weicheng Wang   +5 more
wiley   +1 more source

Influence of the clamping force on the power cycling lifetime reliability of press pack IGBT sub-module

The Journal of Engineering, 2019
The clamping force is the most important parameter of Press Pack IGBTs (PP IGBTs) as it not only affects the electrical, thermal, and mechanical characteristic, but also the long lifetime reliability.
Erping Deng, Jingwei Zhang, Zhibin Zhao, Jie Chen, Jinyuan Li, Yongzhang Huang   +5 more
doaj   +1 more source