Results 51 to 60 of about 17,760,529 (147)

Beyond Conventional Cooling: Advanced Micro/Nanostructures for Managing Extreme Heat Flux

Advanced Materials, Volume 38, Issue 5, 22 January 2026.
This review examines the design, application, and manufacturing of biomimetic or engineered micro/nanostructures for managing high heat‐flux in multi‐level electronics by enhancing conductive, convective, phase‐changing, and radiative heat transfer mechanisms, highlighting their potential for efficient, targeted thermal management, and future prospects.
Yuankun Zhang, Huajie Li, Yuhang Zhou, Jun Ma, Keng‐Te Lin, Han Lin, Chunsheng Guo, Baohua Jia   +7 more
wiley   +1 more source

Influence of the clamping force on the power cycling lifetime reliability of press pack IGBT sub-module

The Journal of Engineering, 2019
The clamping force is the most important parameter of Press Pack IGBTs (PP IGBTs) as it not only affects the electrical, thermal, and mechanical characteristic, but also the long lifetime reliability.
Erping Deng, Jingwei Zhang, Zhibin Zhao, Jie Chen, Jinyuan Li, Yongzhang Huang   +5 more
doaj   +1 more source

An Open Access Database of Power Diode Characteristics at Cryogenic Temperature

IET Electric Power Applications, Volume 20, Issue 1, January/December 2026.
The development of power electronic converters operating at cryogenic temperatures is limited by the lack of data on electronic components outside the standard temperature range specified by manufacturers (typically above −65°C, i.e., 208 K). To fill this gap, the construction of an open access database of power electronic component characteristics at ...
Yasmine Baazizi, Ana Luiza Haas Bezerra, Alma Lemansour, Lauro Ferreira, Simon Meunier, Tanguy Phulpin, Loïc Quéval   +6 more
wiley   +1 more source

Recent Advances in Hybrid, Plug‐In, Battery, and Fuel Cell EVs: Control Schemes, Modes, Converter Topologies, and Pros and Cons

IET Electrical Systems in Transportation, Volume 2026, Issue 1, 2026.
Direct current (DC)–DC converters are the backbone of electric vehicle (EV) power trains, enabling efficient and bidirectional energy flow between the battery, high‐voltage (HV) DC link, and auxiliary rails under tight isolation, gain, ripple, and electromagnetic interference (EMI) constraints.
Abhilash Sakhare, Suresh Mikkili, Praveen Kumar Bonthagorla, Fabio Crescimbini   +3 more
wiley   +1 more source

High-Voltage and High-Current IGBT Press-pack Module for Power Grid

, 2022
On the basis of the development and application requirements of flexible DC transmission techniques, a 1 kA/10 kV half-bridge IGBT press-pack module is studied.
Jiang, Jing (author), Tan, C. (author), Zhang, Kouchi (author), Liu, X. (author), Ye, H. (author), Wang, S. (author), Shaogang Wang, Chunjian Tan, Guoqi Zhang, Huaiyu Ye, Jing Jiang, Xu Liu   +11 more
core   +1 more source

A new symmetric modular eleven‐level inverter using single and double source unit for low voltage applications with reduced number of switches

IET Power Electronics, Volume 19, Issue 1, January/December 2026.
This study introduces a new modular multilevel inverter that can produce five levels of positive voltage using only six power switches and five DC voltage sources. The basic unit is composed of a single‐ and double‐source (SDS) unit. SDS reduces the number of power electronic components, such as the insulated gate bipolar transistors, freewheeling ...
Naser Fakhri, Sara Laali, Mohammad Salay Naderi, Hossein Rahimi, Saeid Gholami Farkoush   +4 more
wiley   +1 more source

Experimental Study of the Fretting Amplitude of the Contact Surface in a PP‐IGBT Module During Power Cycling

IET Power Electronics, Volume 19, Issue 1, January/December 2026.
This work investigates the displacement amplitude of the contact surfaces between the Si chip and the Mo emitter plate of a PP‐IGBT module during power cycling on the basis of experimental measurements, as well as the effects of loading conditions such as the load current, switching time and normal load on the displacement amplitude.
Tong An, Yunzhi Qi, Xueheng Zheng, Fei Qin, Xiang Wang, Jianqiang Li   +5 more
wiley   +1 more source

3D Lumped Thermal Model for Compliant Press‐Pack IGBT Submodule in MMC

IET Power Electronics, Volume 19, Issue 1, January/December 2026.
We present a 3D lumped thermal model for compliant press‐pack IGBT submodules in MMCs. The model accounts for double‐sided cooling and thermal coupling, achieving high accuracy and efficiency, making it suitable for real‐time condition monitoring. ABSTRACT The compliant press‐pack IGBT is widely used in modular multilevel converters (MMCs).
Shuguo Gao, Haoyu Liu, Ruiyi Fan, Lingyu Zhu, Jinxi Li, Weicheng Wang   +5 more
wiley   +1 more source

An Early‐Stage Bond Wire Lift‐Off Defect Identification Method Based on Surface Temperature Rise Characteristics

IET Power Electronics, Volume 19, Issue 1, January/December 2026.
Bond wire lift‐off is one of the primary failure modes in power modules and early identification of its degradation state and lift‐off ratio is crucial for ensuring reliable operation. Conventional methods have limitations in quantifying early‐stage lift‐off defects.
Xuanyi Liu, Jianghai Geng, Ping Wang, Sizu Hou, Wenzhen Guo, Jiehui Lin, Yunpeng Liu   +6 more
wiley   +1 more source

大容量全控型压接式IGBT和IGCT器件对比分析:原理, 结构, 特性和应用

, 2022
Fully-controlled press-pack devices are the core components of large-capacity power electronic equipment for power conversion, mainly including thyristor-like devices such as integrated gate commutated thyristor (IGCT), and transistor-like devices such ...
Bai, Ruihang, Wu, Jinpeng, Zhao, Biao, Chen, Zhengyu, Yu, Zhanqing, Zeng, Rong, Liu, Jiapeng, Zhou, Wenpeng   +7 more
core   +1 more source