Results 31 to 40 of about 4,301 (207)

Press-pack IGBTs for HVDC and FACTs

open access: yesCSEE Journal of Power and Energy Systems, 2017
The popularity of insulated gate bipolar transistors (IGBTs) for use in high-voltage direct current (HVDC) transmission and flexible AC transmission systems (FACTS) is increasing. Unfortunately, for these applications wire-bond IGBT technology has a number of shortcomings, such as insufficient current ratings for the most powerful schemes, and ...
Robin Simpson   +5 more
openaire   +1 more source

The state-of-the-art of power electronics in Japan [PDF]

open access: yes, 1998
Since the late 1950s, power electronics has been developing by leaps and bounds without saturation to become the key technology essential to modern society and human life as well as to electrical engineering. This paper mainly focuses on the state-of-the-
Akagi, Hirofumi
core   +1 more source

Deformation Analysis of Press-Pack IGBT Using Thermal Mechanical Coupling Method [PDF]

open access: yes, 2022
Press-pack Insulated Gate Bipolar Transistors (PP IGBT) are becoming increasingly used in HVDC and FACT applications. Due to its unique packaging, its reliability issues have also attracted increasing attention in the engineering field. More comprehensive investigation into the thermal, electrical and mechanical factors should be conducted to reveal ...
Gu, Bowen   +5 more
openaire   +1 more source

Power Electronics – The Key Technology for Renewable Energy System Integration [PDF]

open access: yes, 2015
The energy paradigms in many countries (e.g. Germany and Denmark) have experienced a significant change from fossil-based resources to clean renewables (e.g. wind turbines and photovoltaics) in the past few decades.
Blaabjerg, Frede   +3 more
core   +2 more sources

Fault-tolerant design approach for reliable offshore multi-megawatt variable frequency converters

open access: yesJournal of Ocean Engineering and Science, 2016
Inverters play a key role in realizing reliable multi-megawatt power electronic converters used in offshore applications, as their failure leads to production losses and impairs safety.
N. Vedachalam   +2 more
doaj   +1 more source

Overview of monitoring methods of press‐pack insulated gate bipolar transistor modules under different package failure modes

open access: yesIET Power Electronics, 2023
Press‐pack insulated gate bipolar transistor modules (PP‐IGBTs) have been widely used in high‐voltage and high‐power‐density applications, such as high‐voltage direct‐current (HVDC) converters, because of their advantages of low thermal resistance ...
Renkuan Liu   +5 more
doaj   +1 more source

Evaluation of SiC Schottky diodes using pressure contacts [PDF]

open access: yes, 2017
The thermomechanical reliability of SiC power devices and modules is increasingly becoming of interest especially for high power applications where power cycling performance is critical. Press-pack assemblies are a trusted and reliable packaging solution
Alatise, Olayiwola   +7 more
core   +3 more sources

High-throughput and Full Automatic DBC-Module Screening Tester for High Power IGBT [PDF]

open access: yes, 2015
We developed a high-throughput screening tester for DBC-module of IGBT. The tester realizes a new screening test with current distribution in addition to a conventional switching test. It consists of a power circuit, a replaceable test head, sensor array
Noda R.   +5 more
core   +2 more sources

The Impact of Power Switching Devices on the Thermal Performance of a 10 MW Wind Power NPC Converter

open access: yesEnergies, 2012
Power semiconductor switching devices play an important role in the performance of high power wind energy generation systems. The state-of-the-art device choices in the wind power application as reported in the industry include IGBT modules, IGBT press ...
Ke Ma, Frede Blaabjerg
doaj   +1 more source

Influence of N2 pressure on surface discharge characteristics of PEEK under positive repetitive square voltage

open access: yesHigh Voltage, 2021
PEEK (polyetheretherketone) and N2 are used in the packaging of high‐voltage power electronics as the frame material and insulation gas, respectively. The surface discharge behaviours of PEEK in N2 under positive repetitive square voltage are the main ...
Ye Li   +4 more
doaj   +1 more source

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