Results 51 to 60 of about 4,301 (207)

Partial discharge characteristics of peek utilized in press-pack IGBT under DC voltage

Electrical Engineering
Modular multilevel converters (MMCs) have been utilized in solid-state transformers (SSTs). With the increasing demand in high-voltage power module in MMC-SST, press-pack IGBTs are very promising.
Peng Yang, Haoyu Liu, Chenshuo Liu, Shuguo Gao   +3 more
semanticscholar   +1 more source

Power outage detection methods for theoperation of a shunt active power flter as energy backup system [PDF]

, 2014
This paper presents the study of power outage detection methods that can be applied to a Shunt Active Power Filter (SAPF) with energy backup capability.
A. Moschitta, J. Pitt, J.G. Pinto, J.M. Gurrero, K.N. Reddy, X. Fang   +5 more
core   +3 more sources

Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics

Advanced Science, Volume 13, Issue 17, 23 March 2026.
This review surveys emerging materials for thermal management in advanced electronic packaging, with emphasis on ceramic substrates and thermal interface materials. Multiscale simulations and mechanistic analyses are highlighted, alongside the emerging role of artificial intelligence in predicting thermal properties and guiding design, offering ...
Yongjun Huo, Jiaqi Song, Wenqian Li, Jian Zhang, Yujin Zhang, Yang Fu, Wangchao Yuan, Xin Chen, Sichen Liu, Miao Jiang, Yuan Cheng, Gang Zhang   +11 more
wiley   +1 more source

Comparison of power electronics lifetime between vertical- and horizontal-axis wind turbines [PDF]

, 2016
A comparison has been made of the power electronics lifetime for 5MW horizontal- and vertical-axis wind turbines, based on dynamic models supplied with generated wind speed time series.
Giles, Alex, Parker, Max Alexander, Soraghan, Conaill   +2 more
core   +2 more sources

Comparison of Fuzzy Logic and PID Control in H‐Bridge Inverter: Performance Analysis and Response Optimization

Engineering Reports, Volume 8, Issue 2, February 2026.
Under identical conditions, we benchmark PID against Fuzzy‐Logic control for a single‐phase H‐bridge inverter. FLC achieves faster rise/settling with lower THD and better disturbance rejection than tuned PID while requiring explicit rule design—offering a reproducible baseline and deployment guidance for power‐quality‐constrained inverter applications.
Baraa Taha, Ayad Q. Al‐Dujaili, Eduardo Campos Mercado, Wulfran Fendzi Mbasso, Ali Elrashidi   +4 more
wiley   +1 more source

Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules [PDF]

, 2016
SiC is a wide bandgap semiconductor with better electrothermal properties than silicon, including higher temperature of operation, higher breakdown voltage, lower losses and the ability to switch at higher frequencies.
A. Castellazzi, A.M. Aliyu, Banu, Busca, GopiReddy, Herold, J. Ortiz Gonzalez, L. Ran, Lutz, O. Alatise, P. Mawby, Rajaguru, Rencz, Sugawara, Szekely, Székely, Yovanovich   +16 more
core   +2 more sources

Beyond Conventional Cooling: Advanced Micro/Nanostructures for Managing Extreme Heat Flux

Advanced Materials, Volume 38, Issue 5, 22 January 2026.
This review examines the design, application, and manufacturing of biomimetic or engineered micro/nanostructures for managing high heat‐flux in multi‐level electronics by enhancing conductive, convective, phase‐changing, and radiative heat transfer mechanisms, highlighting their potential for efficient, targeted thermal management, and future prospects.
Yuankun Zhang, Huajie Li, Yuhang Zhou, Jun Ma, Keng‐Te Lin, Han Lin, Chunsheng Guo, Baohua Jia   +7 more
wiley   +1 more source

High Power Press-pack IGBT and Its Application in Pulsed Magnetic-field Generator

Kongzhi Yu Xinxi Jishu, 2017
In some special field of high voltage and high current, the application of conventional IGBT will increase the complexity of system structure and difficulties of control. Therefore, this paper introduced a new type of power press-pack IGBT device.
CHEN Jun, WAN Chaoqun, CHEN Yan, LI Xiaolin   +3 more
doaj  

A new symmetric modular eleven‐level inverter using single and double source unit for low voltage applications with reduced number of switches

IET Power Electronics, Volume 19, Issue 1, January/December 2026.
This study introduces a new modular multilevel inverter that can produce five levels of positive voltage using only six power switches and five DC voltage sources. The basic unit is composed of a single‐ and double‐source (SDS) unit. SDS reduces the number of power electronic components, such as the insulated gate bipolar transistors, freewheeling ...
Naser Fakhri, Sara Laali, Mohammad Salay Naderi, Hossein Rahimi, Saeid Gholami Farkoush   +4 more
wiley   +1 more source

Design, analysis, and testing of PP-IGBT-based submodule stack for the MMC VSC HVDC with 3000 A DC bus current

The Journal of Engineering, 2018
Voltage sourced converter (VSC) high-voltage direct current (HVDC) is moving to higher DC voltage and capacity, such as ±500 kV/3000 MW and ±800 kV/5000 MW for a single converter, which will bring tremendous challenges for converter submodule design ...
Huifeng Chen, Frank Wakeman, Julian Pitman, Gangru Li   +3 more
doaj   +1 more source