Results 71 to 80 of about 4,301 (207)
High-throughput DBC-assembled IGBT screening for power module [PDF]
, 2014 High-throughput DBC-assembled IGBT screening equipment for a production line is under development in order to prevent early failure of power modules.
Noda Ryuzo +4 more
core +1 more source
Edge‐Free Graphene‐Derived Mesoporous Carbon for High‐Voltage Supercapacitors
Small Structures, Volume 6, Issue 10, October 2025.A defect‐minimized, edge‐free graphene‐derived mesoporous carbon (GMC) is synthesized via a rapid carbothermal shock process. The GMC shows ultrahigh surface area, high conductivity (≈9000 S m−1), and excellent electrochemical performance (≈250 F g−1 , 10,000+ cycles at 4.4 V), offering a scalable path to high‐voltage energy storage.
Mitesh Ganpat Mapari +4 more
wiley +1 more source
Thermal Design and Simulation of High Power Press-pack IGBT Module
Kongzhi Yu Xinxi Jishu, 2016 With the improvement of packaging power level of IGBT module, power density and operating temperature on chip will rise, which may lead to an increasing affect of thermal stress on long-term reliability of the device.
XIAO Hongxiu, DOU Zechun, PENG Yongdian
doaj
Recent Advanced Ultra‐Wide Bandgap β‐Ga2O3 Material and Device Technologies
Advanced Electronic Materials, Volume 11, Issue 1, January 2025.The advanced ultra‐wide bandgap semiconductor material β‐Ga2O3 is highly favored for its exceptional material properties. This sudy provides a comprehensive review of its developments in areas such as materials, power devices, and RF devices. The current status of its commercialization process is outlined, along with an analysis of the challenges it is
Sihan Sun +5 more
wiley +1 more source
Estimation of the power electronics lifetime for a wind turbine [PDF]
, 2013 A comparison has been made of the converter lifetime for a 3MW horizontal axis wind turbine for different wind turbulence levels. Torque and speed of the turbine shaft were used to calculate voltage and current time series that those were used to ...
Givaki, Kamyab +2 more
core
IET Electric Power Applications, Volume 19, Issue 1, January/December 2025.Large‐capacity high voltage direct current (HVDC) transformers are the core equipment of the future power system. The design and operation of these transformers involve the interaction of multiple physical fields. The use of multiphysics simulation technology can comprehensively consider the coupling effects of various physics, which can help optimise ...
Jianwen Nie +4 more
wiley +1 more source
Electrical Materials and Applications, Volume 2, Issue 1, January/December 2025.This review summarises advanced DC–DC converter topologies for BEVs, HEVs, PHEVs and FCEVs, emphasising high‐efficiency wide bandgap (SiC/GaN) devices and bidirectional power flow. It highlights challenges, such as EMI, thermal management and emerging AI‐driven diagnostics, for future electric vehicle power electronics.
Abhilash Sakhare, Suresh Mikkili
wiley +1 more source
IET Generation, Transmission &Distribution, Volume 19, Issue 1, January/December 2025.1. A refined component‐level reliability model for four‐port soft open points (SOPs) is developed, explicitly incorporating correlations among sub‐modules (SMs) of hybrid modular multi‐level converters (MMCs). 2. A load restoration optimisation model is formulated, explicitly integrating SOP fault modes to achieve optimal load recovery via multi‐device
Yiqin Shi +3 more
wiley +1 more source
IET Power Electronics, Volume 18, Issue 1, January/December 2025.In this paper, applied heating was shown to effectively inhibit dendritic corrosion growth, formed in the power module isolation trenches in corrosive environments, by reducing the effective relative humidity and thereby the thickness of the adsorbed water layer on the ceramic substrate surface. The findings can be applied to enhance the reliability of
Juuso Rautio +7 more
wiley +1 more source
Life Prediction Model for Press-Pack IGBT Module Based on Thermal Resistance Degradation
ElectronicsThe contact interfaces of a press-pack insulated-gate bipolar transistor (PP-IGBT) module under fluctuating thermal stress will undergo minor friction and mutual sliding during service, which results in damage to the contact surface and a decline in the ...
Rui Zhou +6 more
semanticscholar +1 more source