Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling. [PDF]
Tan L +5 more
europepmc +1 more source
An Advanced Permanent Magnet Motor Drive System for Battery-Powered Electric Vehicles [PDF]
Recent availability of high-energy neodymium-ironboron (Nd-Fe-B) permanent magnet (PM) material has focused attention on the use of the PM synchronous motor (PMSM) drive for electric vehicles (EV's).
Chan, CC, Chau, KT
core +1 more source
Analysis and Comparison of Peak-to-Peak Current Ripple in Two-Level and Multilevel PWM Inverters [PDF]
Three-phase multilevel inverters are used in many medium- and high-power applications such as motor drives and grid-connected systems. Despite numerous PWM techniques for multilevel inverters have been developed, the impact of these modulation schemes on
Dordevic, O, Grandi, G, Loncarski, J
core +1 more source
Design and Characteristic Analyss of Novel Press-Contact IGBT Module
Design of a novel pressure-contact IGBT module was stated. The advantages with respect to conventional IGBT modules were compared as well. The characteristics determined by static and dynamic tests demonstrated good performance and wide suitability for ...
DOU Ze-chun +4 more
doaj
An Improved Voltage Clamp Circuit Suitable for Accurate Measurement of the Conduction Loss of Power Electronic Devices. [PDF]
Yu Q, Zhao Z, Sun P, Zhao B, Cai Y.
europepmc +1 more source
Printed Circuit Boards: The Layers' Functions for Electronic and Biomedical Engineering. [PDF]
Perdigones F, Quero JM.
europepmc +1 more source
Unified architecture of single-phase active power filter with battery interface for UPS operation [PDF]
This paper presents a shunt active power filter with battery interface for uninterruptible power supply (UPS) operation. The proposed unified architecture is composed by a single-phase ac-dc converter from the power grid side and by a bidirectional ...
Afonso, José A. +4 more
core
Power Cycle Testing of Press-Pack IGBT Chips [PDF]
In this thesis the power cycling capability of individual press-pack IGBT chips is investigated. Press-pack is a packaging technology used for power semiconductors.
Frank, Øyvind Bjerke
core
Structure development and simulation of plug-in hybrid electric vehicle [PDF]
Electric-drive vehicles (EDVs) have gained attention, especially in the context of growing concerns about global warming and energy security aspects associated with road transport.
Marozka, Aleh, Petrenko, Y. N.
core
High reliable press packed IGBT
Hideo Matsuda +4 more
openaire +2 more sources

