Results 111 to 120 of about 139 (128)

Deformation Analysis of Press-Pack IGBT Using Thermal Mechanical Coupling Method

Lecture Notes in Electrical Engineering, 2022
Volker Pickert, Haimeng Wu, Bing Ji
exaly  

Lifetime prediction for press pack IGBT device by considering fretting wear failure

Microelectronics Reliability, 2023
Ran Yao, Wei Lai, Xianping Chen
exaly  

A Thermal Twin Modeling Method of Press Pack IGBT Based on Power Loss

IEEE Transactions on Electron Devices, 2022
Ran Yao, Wei Lai, Xianping Chen
exaly  

Study on thermal buffering effect of phase change material on press- pack IGBT

International Journal of Heat and Mass Transfer, 2020
Gaofeng Hao, Li Ran
exaly  

Experimental Investigations on Current Sharing Characteristics of Parallel Chips Inside Press-Pack IGBT Devices

IEEE Transactions on Power Electronics, 2022
Jiayu Fan, Zhibin Zhao, Xuebao Li
exaly  

Current Measurement Method of Multiple Chips Using Rectangular PCB Rogowski Coils Integrated in Press Pack IGBT Device

IEEE Transactions on Power Electronics, 2023
Shi Fu, Zhibin Zhao, Xuebao Li
exaly  

Press-pack IGBTs, semiconductor switches for pulse power

PPPS-2001 Pulsed Power Plasma Science 2001. 28th IEEE International Conference on Plasma Science and 13th IEEE International Pulsed Power Conference. Digest of Papers (Cat. No.01CH37251), 2001
F. Wakeman, W. Findlay, null Gangru Li
openaire   +1 more source

A Temperature Monitoring Method for Press Pack IGBT Based on Digital Twin

2022
Ran Yao, Wei Lai, Bailing Zhou
exaly  

Fretting wear failure of press pack IGBT devices

IET Conference Proceedings
Guowei Zhou, Junhua Hu, Hankun Fan
openaire   +1 more source

Characterizations of a Proposed 3300-V Press-Pack IGBT Module Using Nanosilver Paste for High-Voltage Applications

IEEE Journal of Emerging and Selected Topics in Power Electronics, 2018
Yunhui Mei, Guo-Quan Lu
exaly