Results 61 to 70 of about 17,691,121 (147)

An Early‐Stage Bond Wire Lift‐Off Defect Identification Method Based on Surface Temperature Rise Characteristics

IET Power Electronics, Volume 19, Issue 1, January/December 2026.
Bond wire lift‐off is one of the primary failure modes in power modules and early identification of its degradation state and lift‐off ratio is crucial for ensuring reliable operation. Conventional methods have limitations in quantifying early‐stage lift‐off defects.
Xuanyi Liu, Jianghai Geng, Ping Wang, Sizu Hou, Wenzhen Guo, Jiehui Lin, Yunpeng Liu   +6 more
wiley   +1 more source

大容量全控型压接式IGBT和IGCT器件对比分析:原理, 结构, 特性和应用

, 2022
Fully-controlled press-pack devices are the core components of large-capacity power electronic equipment for power conversion, mainly including thyristor-like devices such as integrated gate commutated thyristor (IGCT), and transistor-like devices such ...
Bai, Ruihang, Wu, Jinpeng, Zhao, Biao, Chen, Zhengyu, Yu, Zhanqing, Zeng, Rong, Liu, Jiapeng, Zhou, Wenpeng   +7 more
core   +1 more source

An Accurate On‐State Voltage Measurement Circuit for Chip‐Level Junction Temperature Monitoring of Press‐Pack IGBT

IET Power Electronics, Volume 19, Issue 1, January/December 2026.
This paper proposes a novel on‐state voltage measurement circuit (OVMC) for accurate online Vce extraction. By adopting a power‐balanced differential diode topology, the proposed circuit minimises the Vce measurement error. The OVMC is applied to the Buck operating condition to monitor the junction temperature of chips inside a press‐pack IGBT ...
Yihe Zhang, Bin Chen, Yumeng Cai, Peng Sun, Xuebao Li, Zhibin Zhao, Shenyang Mo, Zhong Chen   +7 more
wiley   +1 more source

A Multi‐Objective Optimisation Method for Wide‐Band Integrated Hybrid Current Sensors in Power Modules

IET Power Electronics, Volume 19, Issue 1, January/December 2026.
A sensor structure design scheme is proposed in this work by establishing the transmission characteristic model, which quantitatively calculates geometric parameters and sensitivity relationships between tunnel magneto‐resistance (TMR) and Rogowski coils.
Ze Zhou, Zhen Xin, Haoze Luo, Zhiqiang Yu, Zhaohe Meng   +4 more
wiley   +1 more source

Converter structure-based power loss and static thermal modeling of the press-pack IGBT-based three-level ANPC and HB VSCs applied to Multi-MW wind turbines [PDF]

, 2010
In this study, the converter-structure based power loss and thermal models are developed for the medium voltage full-scale 3LANPC- VSC and 3L-HB-VSC utilizing press-pack IGBT-diode pairs and interfacing a 6MW wind turbine to a medium voltage grid ...
Osman S. Senturk, Helle, L, Munk-Nielsen, Stig, Teodorescu, Remus, Munk-Nielsen, Stig; id_orcid, Helle, Lars, Rodriguez, Pedro, Senturk, Osman Selcuk, Lars Helle, Senturk, Osman S., Teodorescu, Remus; id_orcid, Rodríguez Cortés, Pedro, Remus Teodorescu, Pedro Rodriguez, Stig Munk-Nielsen   +14 more
core   +1 more source

Modeling Methods for Internal Transient Processes of Controllable Line-Commutated Converters Under AC Voltage Disturbance

Energies
A Controllable Line-Commutated Converter (CLCC) is a novel piece of equipment for enhancing the commutation failure resistance of High-Voltage Direct Current (HVDC) transmission systems.
Mengting Yang, Zhaoxin Du, Wenbin Zhao
doaj   +1 more source

A Universal PCB Rogowski Coils Turns Arrangement Method for Anti‐Interference From Adjacent Conductors in Press‐Pack IGBT

IET Power Electronics
The high‐power press‐pack insulate gate bipolar transistor (IGBT) is the core device of a high‐voltage converter. The current sharing and aging characteristics of many parallel chips in IGBT are critical issues regarding its operational reliability.
Litong Wang, Jinze Li, Xin Liu, Xingguang Yan, Haifeng Sun, Guowei Zhou   +5 more
doaj   +1 more source

High-Frequency Transient Overvoltage Analysis of MMC-HVDC Converter Valves Based on a Multi-Scale Wideband Model

Energies
External steep-front transient overvoltages may introduce high-frequency electromagnetic disturbances into modular multilevel converter-based high-voltage direct current (MMC-HVDC) systems, resulting in additional transient voltage stresses on converter ...
Qian Li, Zhichao Yang, Jianfei Ji, Bing Chen, Yong Ju, Luxing Zhao   +5 more
doaj   +1 more source

An Improved Voltage Clamp Circuit Suitable for Accurate Measurement of the Conduction Loss of Power Electronic Devices. [PDF]

Sensors (Basel), 2021
Yu Q, Zhao Z, Sun P, Zhao B, Cai Y.
europepmc   +1 more source

Printed Circuit Boards: The Layers' Functions for Electronic and Biomedical Engineering. [PDF]

Micromachines (Basel), 2022
Perdigones F, Quero JM.
europepmc   +1 more source