Results 61 to 70 of about 4,301 (207)

Improved reliability of planar power interconnect with ceramic-based structure [PDF]

open access: yes, 2018
This paper proposes an advanced Si3N4 ceramic-based structure with through vias designed and filled with brazing alloy as a reliable interconnect solution in planar power modules. Finite element (FE) modeling and simulation were first used to predict the
Corfield, Martin   +7 more
core   +1 more source

Experimental Study of the Fretting Amplitude of the Contact Surface in a PP‐IGBT Module During Power Cycling

open access: yesIET Power Electronics, Volume 19, Issue 1, January/December 2026.
This work investigates the displacement amplitude of the contact surfaces between the Si chip and the Mo emitter plate of a PP‐IGBT module during power cycling on the basis of experimental measurements, as well as the effects of loading conditions such as the load current, switching time and normal load on the displacement amplitude.
Tong An   +5 more
wiley   +1 more source

Modular Multilevel Converter Modelling, Control and Analysis under Grid Frequency Deviations [PDF]

open access: yes, 2012
A tool for component sizing for MMCs has been developed and tested through simulations in PLECS. The steady-state behaviour under grid frequency deviations — interesting for offshore wind farm connections — has been analysed, providing insights in MMC ...
da Silva, Rodrigo   +5 more
core   +1 more source

Influence of the clamping force on the power cycling lifetime reliability of press pack IGBT sub-module

open access: yesThe Journal of Engineering, 2019
The clamping force is the most important parameter of Press Pack IGBTs (PP IGBTs) as it not only affects the electrical, thermal, and mechanical characteristic, but also the long lifetime reliability.
Erping Deng   +5 more
doaj   +1 more source

Heat Dissipation Optimisation Design of Pole‐Changing Motor Driver

open access: yesInternational Journal of Energy Research, Volume 2026, Issue 1, 2026.
Current research focuses primarily on studying the heat dissipation modes of drive devices in various configurations to optimise the energy consumption of cooling systems in new energy vehicles and improve their driving range; however, the overall power consumption is not yet fully grasped or controlled.
Yangfeng Cao   +4 more
wiley   +1 more source

Reliability modelling and analysis on MMC for VSC-HVDC by considering the press-pack IGBT and capacitors failure

open access: yesThe Journal of Engineering, 2019
Modular multi-level converter (MMC) with press-packing IGBT devices is the popular and key equipment of VSC-HVDC system, its reliability is directly related to the equipment safe operation.
Li Hui   +6 more
doaj   +1 more source

Regenerative braking using buckboost converter [PDF]

open access: yes, 2014
A Buck Boost converter circuit has been designed and simulated to drive a dc motor for an electric vehicle. The design consists of an IGBT Buck-Boost converter, the battery pack in the Buck side and a capacitor in the Boost side. The main battery has the
Satapathy, P P
core  

Comparison of Neuro‐Fuzzy and Neural Network Techniques for Estimating the Line Voltage of 8E Electrical Locomotives

open access: yesInternational Transactions on Electrical Energy Systems, Volume 2026, Issue 1, 2026.
The South African rail sector is a key contributor to the national economy, boosting gross domestic product (GDP) and creating jobs. However, serious malfunctions often jeopardize the reliability of locomotives such as the Class 8E locomotive, leading to lost output and longer lead times.
Rofhiwa C. Mufamadi   +3 more
wiley   +1 more source

Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects [PDF]

open access: yes, 2014
A stacked substrate–chip–bump–chip–substrate assembly has been demonstrated in the construction of power switch modules with high power density and good electrical performance.
Castellazzi, Alberto   +5 more
core   +3 more sources

Life Cycle Profile Development for Product Reliability Assessment

open access: yesQuality and Reliability Engineering International, Volume 41, Issue 7, Page 3054-3064, November 2025.
ABSTRACT The life cycle profile (LCP) is a catalog of all the expected loads a given product experiences across its lifetime, from the completion of product manufacture to the end of operation and removal from service. This paper outlines a procedure for developing an LCP, including cataloging estimates of the loads the product experiences over its ...
Abhishek Ram, Diganta Das
wiley   +1 more source

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