Results 41 to 50 of about 2,624 (204)

Fault-tolerant design approach for reliable offshore multi-megawatt variable frequency converters

open access: yesJournal of Ocean Engineering and Science, 2016
Inverters play a key role in realizing reliable multi-megawatt power electronic converters used in offshore applications, as their failure leads to production losses and impairs safety.
N. Vedachalam   +2 more
doaj   +1 more source

Overview of monitoring methods of press‐pack insulated gate bipolar transistor modules under different package failure modes

open access: yesIET Power Electronics, 2023
Press‐pack insulated gate bipolar transistor modules (PP‐IGBTs) have been widely used in high‐voltage and high‐power‐density applications, such as high‐voltage direct‐current (HVDC) converters, because of their advantages of low thermal resistance ...
Renkuan Liu   +5 more
doaj   +1 more source

Quantitative microstructure characterization of Ag nanoparticle sintered joints for power die attachment [PDF]

open access: yes, 2014
The samples of sintered Ag joints for power die attachments were prepared using paste of Ag nanoparticles at 240 °C and 5 MPa for 3 to 17 minutes. Their microstructural features were quantitatively characterized with scanning elec-tronic microscopy ...
Christopher Mark Johnson   +8 more
core   +2 more sources

The Impact of Power Switching Devices on the Thermal Performance of a 10 MW Wind Power NPC Converter

open access: yesEnergies, 2012
Power semiconductor switching devices play an important role in the performance of high power wind energy generation systems. The state-of-the-art device choices in the wind power application as reported in the industry include IGBT modules, IGBT press ...
Ke Ma, Frede Blaabjerg
doaj   +1 more source

Influence of N2 pressure on surface discharge characteristics of PEEK under positive repetitive square voltage

open access: yesHigh Voltage, 2021
PEEK (polyetheretherketone) and N2 are used in the packaging of high‐voltage power electronics as the frame material and insulation gas, respectively. The surface discharge behaviours of PEEK in N2 under positive repetitive square voltage are the main ...
Ye Li   +4 more
doaj   +1 more source

Modular Multilevel Converter Modelling, Control and Analysis under Grid Frequency Deviations [PDF]

open access: yes, 2012
A tool for component sizing for MMCs has been developed and tested through simulations in PLECS. The steady-state behaviour under grid frequency deviations — interesting for offshore wind farm connections — has been analysed, providing insights in MMC ...
da Silva, Rodrigo   +5 more
core   +1 more source

Integrated half-bridge switch using 70-μm-thin devices and hollow interconnects [PDF]

open access: yes, 2015
An application-oriented integration concept for a half-bridge switch assembly has been developed based on the latest generation 70- μm-thin insulated gate bipolar transistors and diodes, which are rated at 600 V/200 A. This paper addresses the design and
Castellazzi, Alberto   +3 more
core   +2 more sources

Weibull‐Neural Network Framework for Wind Turbine Lifetime Monitoring and Disturbance Identification

open access: yesWind Energy, Volume 29, Issue 4, April 2026.
ABSTRACT Wind turbines are vital for sustainable energy, yet their reliability under diverse operational and environmental conditions remains a challenge, often leading to costly failures. This study presents a novel Weibull‐Neural Network Framework to enhance wind turbine lifetime monitoring by estimating reliability (R(t)) and mean residual life (MRL)
Fatemeh Kiadaliry   +2 more
wiley   +1 more source

Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules [PDF]

open access: yes, 2016
SiC is a wide bandgap semiconductor with better electrothermal properties than silicon, including higher temperature of operation, higher breakdown voltage, lower losses and the ability to switch at higher frequencies.
A. Castellazzi   +16 more
core   +2 more sources

Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics

open access: yesAdvanced Science, Volume 13, Issue 17, 23 March 2026.
This review surveys emerging materials for thermal management in advanced electronic packaging, with emphasis on ceramic substrates and thermal interface materials. Multiscale simulations and mechanistic analyses are highlighted, alongside the emerging role of artificial intelligence in predicting thermal properties and guiding design, offering ...
Yongjun Huo   +11 more
wiley   +1 more source

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