Results 41 to 50 of about 156,728 (358)

The Influence of Etching Method on the Occurrence of Defect Levels in III-V and II-VI Materials

Nanomaterials
The influence of the etching method on the occurrence of defect levels in InAs/InAsSb type-II superlattice (T2SLs) and MCT photodiode is presented. For both analyzed detectors, the etching process was performed by two methods: wet chemical etching and ...
Kinga Majkowycz, Krzysztof Murawski, Małgorzata Kopytko, Krzesimir Nowakowski-Szkudlarek, Marta Witkowska-Baran, Piotr Martyniuk   +5 more
doaj   +1 more source

Tuning Metasurface Dimensions by Soft Nanoimprint Lithography and Reactive Ion Etching

Advanced Photonics Research, 2022
Metasurfaces are ultrathin and flat layers of subwavelength nanostructures composed of metallic or high‐refractive‐index materials. They can alter lightwave properties effectively and show significant application potential in various nanophotonic ...
Xinyi Cao, Yibo Xiao, Qiao Dong, Shaobo Zhang, Junzhuan Wang, Lianhui Wang, Li Gao   +6 more
doaj   +1 more source

Silicone engineered anisotropic lithography for ultrahigh-density OLEDs

Nature Communications, 2022
Ultrahigh-resolution patterning with high-throughput and high-fidelity is highly in demand for expanding the potential of OLEDs. Here, the authors report that silicone-incorporated organic light-emitting semiconductors can achieve anisotropic lithography
Hyukmin Kweon, Keun-Yeong Choi, Han Wool Park, Ryungyu Lee, Ukjin Jeong, Min Jung Kim, Hyunmin Hong, Borina Ha, Sein Lee, Jang-Yeon Kwon, Kwun-Bum Chung, Moon Sung Kang, Hojin Lee, Do Hwan Kim   +13 more
doaj   +1 more source

Nanostructuring lithium niobate substrates by focused ion beam milling

, 2005
We report on two novel ways for patterning Lithium Niobate (LN) at submicronic scale by means of focused ion beam (FIB) bombardment. The first method consists of direct FIB milling on LiNbO3 and the second one is a combination of FIB milling on a ...
A. Sabac, C. Bainier, F. Lacour, Foglietti, Kamp, M. Spajer, M.-P. Bernal, N. Courjal, Restoin, Wu, Yin, Zimmermann   +11 more
core   +3 more sources

Development of Ternary Magnesium Alloys for Laser Powder Bed Fusion: Optimizing Oxide Layer Thickness

Advanced Engineering Materials, EarlyView.
Additive manufacturing of magnesium alloys by laser is difficult because the melting point of the oxide layer is much higher than the evaporation temperature of the metal underneath. Making the oxide layer thinner can solve this problem. Alloying magnesium with strontium makes the oxide layer thinner, especially at 0.5 wt%.
Elmar Jonas Breitbach, Stefan Julmi, Sabine Behrens, Tatiana Blank, Arvid Abel, Nicole Emminghaus, Ludger Overmeyer, Christian Klose, Hans Jürgen Maier   +8 more
wiley   +1 more source

Development of a Novel Processing Route for Dispersoid/Precipitation‐Strengthened High Conductive Copper Alloys by Using Metalized Nanoceramics in Additive Manufacturing

Advanced Engineering Materials, EarlyView.
This study explores a process chain to produce dispersoid‐strengthened CuCr1Zr for applications requiring high strength and conductivity. Using gas‐atomized powder and copper‐plated alumina nanoparticles, additive manufacturing is performed via powder bed based additive manufacturing with green and red lasers, followed by heat treatment.
Heinrich von Lintel, Abdelrahman Elsayed, Lukas Mielewczyk, Katja Eichmann, Julia Grothe, Ulrich Krupp, Avinash Hariharan, Katrin Jahns   +7 more
wiley   +1 more source

Two-step Fabrication of Large Area SiO2/Si Membranes

Medžiagotyra, 2012
Two-step fabrication technique of SiO2/Si membrane combining the deep local etching of double side polished and thermally oxidized silicon <100> wafer in tetramethylammonium hydroxide (TMAH) water solution and SF6/O2 reactive ion etching is ...
Viktoras GRIGALIŪNAS, Brigita ABAKEVIČIENĖ, Ignas GRYBAS, Angelė GUDONYTĖ, Vitoldas KOPUSTINSKAS, Darius VIRŽONIS, Ramūnas NAUJOKAITIS, Sigitas TAMULEVIČIUS   +7 more
doaj   +1 more source

Metal mask free dry-etching process for integrated optical devices applying highly photostabilized resist. [PDF]

, 2006
Photostabilization is a widely used post lithographic resist treatment process, which allows to harden the resist profile in order to maintain critical dimensions and to increase selectivity in subsequent process steps such as reactive ion etching.
Driessen, A., Sengo, G., Wolferen, H., Wörhoff, K.   +3 more
core   +1 more source

Influence of a Hydrogen Addition to the Inert Gas and Subsequent Heat Treatments on the Microstructure and Mechanical Properties of Magnesium WE43 Fabricated by PBF‐LB/M

Advanced Engineering Materials, EarlyView.
This article investigates optimal processing conditions for the laser‐based powder bed fusion of WE43. To limit the interaction with remaining oxygen, a 3 vol% hydrogen admixture to the inert gas is investigated. Furthermore, heat treatments are investigated in the range of 250–350 °C for 48 h.
Arvid Abel, Elmar Jonas Breitbach, Hannes Holländer, Michael Müller, Tjorben Griemsmann, Christian Klose, Jörg Hermsdorf, Hans Jürgen Maier, Stefan Kaierle, Ludger Overmeyer   +9 more
wiley   +1 more source

The role of fluorine-containing ultra-thin layer in controlling boron thermal diffusion into silicon

Journal of Telecommunications and Information Technology, 2023
We have investigated the influence of silicon dioxide reactive ion etching (RIE) parameters on the composition of the polymer layer that is formed during this process on top of the etched layer, and finally, the role of this layer in high- temperature ...
Małgorzata Kalisz, Romuald B. Beck, Adam Barcz, Michał Ćwil   +3 more
doaj   +1 more source