Results 61 to 70 of about 106,837 (225)

Etching technique of high aspect ratio silicon trenches based on CMOS-MEMS process

open access: yesDianzi Jishu Yingyong, 2018
Etching technique of deep silicon trenches with high aspect ratio is critical in improving integration and accuracy of Micro-Electro-Mechanical Systems(MEMS)sensor array and reducing the cost of it.
Zhang Haihua, Lv Yufei, Lu Zhongxuan
doaj   +1 more source

Single-Step CMOS Compatible Fabrication of High Aspect Ratio Microchannels Embedded in Silicon

open access: yesProceedings, 2017
This paper presents a new method for the CMOS compatible fabrication of microchannels integrated into a silicon substrate. In a single-step DRIE process (Deep Reactive Ion Etching) a network of microchannels with High Aspect Ratio (HAR) up to 10, can be ...
Marta Kluba   +4 more
doaj   +1 more source

The Fabrication of THz Emitting Mesas by Reactive Ion-Beam Etching of Superconducting Bi2212 with Multilayer Masks

open access: yes, 2011
Generation of powerful THz radiation from intrinsic Josephson Junctions (IJJs) of Bi2Sr2CaCu2O8+δ (Bi2212) may require mesas with large lateral dimensions. However, there are difficulties in fabrication of perfect rectangular mesas. The lateral angles of
H. Koseoglu   +3 more
semanticscholar   +1 more source

UV-Nanoimprint and Deep Reactive Ion Etching of High Efficiency Silicon Metalenses: High Throughput at Low Cost with Excellent Resolution and Repeatability. [PDF]

open access: yesNanomaterials (Basel), 2023
Dirdal CA   +8 more
europepmc   +1 more source

Unraveling the Mechanism of Maskless Nanopatterning of Black Silicon by CF4/H2 Plasma Reactive-Ion Etching. [PDF]

open access: yesACS Omega, 2022
Ghezzi F   +8 more
europepmc   +1 more source

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