Results 11 to 20 of about 122,069 (205)

The Location Monitoring of Fatigue Crack Damage by Using the Spectral Area Extracted from FBG Spectra

open access: yesSensors, 2020
In this paper, a new damage feature, spectral area, was extracted to effectively detect crack location by studying the deformation mechanism of fiber Bragg grating (FBG) reflection spectra.
Yan Zhao   +4 more
doaj   +1 more source

Mechanical Analysis of Preventing Reflection Cracks Based on Stress Absorbing Layer

open access: yesAdvances in Civil Engineering, 2022
After asphalt concrete overlay, the reflection crack in the old pavement remains a great challenge. In order to overcome this problem, here, we report the effect of stress absorbing layer on the reflection crack.
Lingjie Han   +3 more
doaj   +1 more source

Simulation of Impedance Discontinuities Resulting from Degradation of Interconnections on Printed Circuit Boards [PDF]

open access: yes, 2011
Numerical simulation of impedance discontinuities resulting from degradation of interconnections on printed circuit ...
Dipartimento Di Elettronica   +7 more
core   +2 more sources

Reflections in a cracked mirror [PDF]

open access: yesBritish Journal of General Practice, 2009
How I hate the modern obsession with reflection. After every talk and lecture, at almost every trainers and appraisers meeting for the last few years and in everything associated with the medical learning industry, I am encouraged to reflect. To reflect on what I have learned and to shine that secondhand light on how my new knowledge will change the ...
openaire   +2 more sources

Non-contact ultrasonic detection of angled surface defects [PDF]

open access: yes, 2011
Non-destructive testing is an important technique, and improvements are constantly needed. Surface defects in metals are not necessarily confined to orientations normal to the sample surface; however, much of the previous work investigating the ...
Clough, A. R.   +3 more
core   +1 more source

Signal enhancement of the in-plane and out-of-plane Rayleigh wave components [PDF]

open access: yes, 2005
Several groups have reported an enhancement of the ultrasonic Rayleigh wave when scanning close to a surface-breaking defect in a metal sample. This enhancement may be explained as an interference effect where the waves passing directly between source ...
Dixon, S.   +3 more
core   +1 more source

Probabilistic Model Updating for Sizing of Hole-Edge Crack Using Fiber Bragg Grating Sensors and the High-Order Extended Finite Element Method

open access: yesSensors, 2016
This paper presents a novel framework for probabilistic crack size quantification using fiber Bragg grating (FBG) sensors. The key idea is to use a high-order extended finite element method (XFEM) together with a transfer (T)-matrix method to analyze the
Jingjing He   +4 more
doaj   +1 more source

Frictional sliding without geometrical reflection symmetry [PDF]

open access: yes, 2016
The dynamics of frictional interfaces play an important role in many physical systems spanning a broad range of scales. It is well-known that frictional interfaces separating two dissimilar materials couple interfacial slip and normal stress variations ...
C. H. Scholz   +8 more
core   +3 more sources

The Reflective Cracking in Flexible Pavements [PDF]

open access: yesRomanian Journal of Transport Infrastructure, 2013
Abstract Reflective cracking is a major concern for engineers facing the problem of road maintenance and rehabilitation. The problem appears due to the presence of cracks in the old pavement layers that propagate into the pavement overlay layer when traffic load passes over the cracks and due to the temperature variation.
openaire   +3 more sources

Observation of nano-indent induced strain fields and dislocation generation in silicon wafers using micro-raman spectroscopy and white beam x-ray topography [PDF]

open access: yes, 2010
In the semiconductor manufacturing industry, wafer handling introduces micro-cracks at the wafer edge. During heat treatment these can produce larger, long-range cracks in the wafer which can cause wafer breakage during manufacture.
A. Zlotos   +29 more
core   +1 more source

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