Molecular engineering of a nonconjugated radical polymer enables a significant enhancement of the glass transition temperature. The amorphous nature and tunability of the polymer, arising from its nonconjugated backbone, facilitates the fabrication of organic memristive devices with an exceptionally high yield (>95%), as well as substantial ...
Daeun Kim +14 more
wiley +1 more source
Stabilizing Stretchable Organic Transistors Through Small-Molecule Additive Blending for Ultra-Sensitive Pesticide Detection. [PDF]
Wang W +9 more
europepmc +1 more source
Reliability Characterization of Wide-Bandgap Semiconductor Switches.
Robert Kaplar +4 more
openalex +1 more source
Reliability prediction of semiconductor devices using modified physics of failure approach
Adithya Thaduri +4 more
openalex +2 more sources
Two‐Dimensional Materials as a Multiproperty Sensing Platform
Various sensing modalities enabled and/or enhanced by two‐dimensional (2D) materials are reviewed. The domains considered for sensing include: 1) optoelectronics, 2) quantum defects, 3) scanning probe microscopy, 4) nanomechanics, and 5) bio‐ and chemosensing.
Dipankar Jana +11 more
wiley +1 more source
Autonomous Hazardous Gas Detection Systems: A Systematic Review. [PDF]
Chew BK, Mahmud A, Singh H.
europepmc +1 more source
The Effect of Diluted N2O Annealing Time on Gate Dielectric Reliability of SiC Metal-Oxide Semiconductor Capacitors and Characterization of Performance on SiC Metal-Oxide Semiconductor Field Effect Transistor [PDF]
Zhihua Dong +9 more
openalex +1 more source
Prediction of power semiconductors devices reliability working in cyclic mode [PDF]
E. V. Kravchenko +1 more
openalex +1 more source
In Situ Study of Resistive Switching in a Nitride‐Based Memristive Device
In situ TEM biasing experiment demonstrates the volatile I‐V characteristic of MIM lamella device. In situ STEM‐EELS Ti L2/L3 ratio maps provide direct evidence of the oxygen vacancies migrations under positive/negative electrical bias, which is critical for revealing the RS mechanism for the MIM lamella device.
Di Zhang +19 more
wiley +1 more source
Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste. [PDF]
Ju YM +5 more
europepmc +1 more source

