Results 281 to 290 of about 2,332,362 (329)

Semiconductor Device Reliability

1989
I. Reliability Testing.- 1.1 The Influence of Temperature and Use Conditions on the Degradation of LED Parameters.- 1.2 An Historical Perspective of GaAs MESFET Reliability Work at Plessey.- 1.3 Screening and Burn-In: Application to Optoelectronic Device Selection for High-Reliability S280 Optical Submarine Repeaters.- 1.4 Assuring the Reliability of ...
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Reliability of MgAI Semiconductor Interconnects

IEEE Transactions on Reliability, 1970
Data are presented comparing 1-percent MgAI wire with 1-percent SiAI wire for ultrasonically bonded interconnects on semiconductor devices. The effects of annealing time and temperature on the strength of the wire demonstrate the mechanical superiority of the 1-percent MgAI wire.
John M. Pankratz, Dean R. Collins
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Reliability investigation of semiconductor coolers

XVI ICT '97. Proceedings ICT'97. 16th International Conference on Thermoelectrics (Cat. No.97TH8291), 2002
The life tests on the thermoelectric shock of semiconductor coolers show that the life of semiconductor coolers follows the Weibull distribution. After the early failed devices are removed, the failure rule of the devices can be described as an exponential distribution. The main failure mode is the crack between electric couple material and welding pad.
null Liu Zhenmao, null Wang Xilian, null Liu Xiaowei, null Quan Wuyun, null Sun Shufang, null Ye Shuichi, null Lui Jingwei, null Chen Lunqiang   +7 more
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Reliability of compound semiconductor devices

2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400), 2002
This paper reviews the reliability problems of compound semiconductor devices. These devices suffer from specific failure mechanisms, which are related to their limited maturity. Only the GaAs MESFETs exhibit a stable technology and an assessed reliability. The metallizations employed in HEMTs already benefit from this assessment.
F. Fantini, L. Cattani, D. Dieci
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Semiconductor Memory Reliability

2009
This chapter contains sections titled: General Reliability Issues RAM Failure Modes and Mechanisms Nonvolatile Memory Reliability Reliability Modeling and Failure Rate Prediction Design for Reliability Reliability Test Structures Reliability Screening and Qualification This chapter contains sections ...
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Semiconductor device reliability vs process quality

Microelectronics Reliability, 1992
Abstract This paper describes a method for defining a quantitative model relating “quality” expressed in terms of parameter distributions and “reliability” expressed in terms of failure rates. This model makes it possible to generate a more realistic failure rate estimate for semiconductor devices.
Riko Radojcic, Paul Giotta
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Reliability evaluation of semiconductor using ultrasound

Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506), 2002
The semiconductor packaging industry is spending a great deal of time and effort developing thinner and thinner packages. Ultrasound works by measuring the amount of signal reflected from material interfaces. Thin packages create a potential problem because the resultant reflected signal from the die top and die attach layers can be nearly superimposed
null Hyoseong Jang, null Job Ha, null Kyungyoung Jhang, null Joonhyun Lee   +3 more
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Practical applications of semiconductor reliability modeling

2015 Annual Reliability and Maintainability Symposium (RAMS), 2015
A practical methodology for modeling the reliability of deep submicron (
Lori E. Bechtold, Florian Moliere, David A. Sunderland, Bahig Tawfellos   +3 more
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Improving reliability engineering in product development based on design theory: the case of FMEA in the semiconductor industry

Research in Engineering Design, 2021
Benjamin Cabanes, S. Hubac, P. le Masson, B. Weil   +3 more
semanticscholar   +1 more source

High Reliability Absolute Semiconductor Pressure Sensor

SAE Technical Paper Series, 1983
<div class="htmlview paragraph">This paper describes an absolute semiconductor pressure sensor suitable for the engine control systems in automobiles. Using the passive (electrically nonconnected) side of a sensor chip as the pressure interface, it has good pressure media compatibility.
M. Bessho, Y. Tsuru, H. Horiike, M. Jinmon, K. Yamagami, S. Wataya   +5 more
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