Results 131 to 140 of about 1,751 (142)
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Impact of Ni Concentration on the Performance of Ni Silicide/HfO2/TiN Resistive RAM (RRAM) Cells
Journal of Electronic Materials, 2014We present a study of Ni silicide as the bottom electrode in HfO2-based resistive random-access memory cells. Various silicidation conditions were used for each device, yielding different Ni concentrations within the electrode. A higher concentration of Ni in the bottom electrode was found to cause a parasitic SET operation during certain RESET ...
Z.X. Chen +9 more
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Microelectronic Engineering, 2015
Display Omitted Effect of oxygen content on electrical performance of ZnO RRAM.Demonstrate the optimal oxygen content in ZnO film for RRAM application.Propose the resistance switching model of ZnO RRAM at different oxygen content. This study investigates the characteristics of zinc oxide (ZnO) film in a resistive random-access memory (RAM) (RRAM) with ...
Cheng-Li Lin +4 more
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Display Omitted Effect of oxygen content on electrical performance of ZnO RRAM.Demonstrate the optimal oxygen content in ZnO film for RRAM application.Propose the resistance switching model of ZnO RRAM at different oxygen content. This study investigates the characteristics of zinc oxide (ZnO) film in a resistive random-access memory (RAM) (RRAM) with ...
Cheng-Li Lin +4 more
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2013 IEEE International Electron Devices Meeting, 2013
We report a novel self-compliant and self-rectifying resistive switching memory cell, with area-scalable switching currents, featuring a set current density of ~5nA/nm2 ( 102 and retention extrapolates to 10yr at 101°C. The switching stack is fully based on ALD processes, using common high-k dielectrics and has a thickness of
B. Govoreanu +15 more
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We report a novel self-compliant and self-rectifying resistive switching memory cell, with area-scalable switching currents, featuring a set current density of ~5nA/nm2 ( 102 and retention extrapolates to 10yr at 101°C. The switching stack is fully based on ALD processes, using common high-k dielectrics and has a thickness of
B. Govoreanu +15 more
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2022
Abstract This systematic literature review navigates the ever-evolving realm of emerging memory technologies, with a specific focus on Resistive RAM (RRAM) and Phase-Change Memory (PCM). The review undertakes a meticulous and comprehensive exploration of these technologies, unraveling their current state, advancements, challenges, and future ...
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Abstract This systematic literature review navigates the ever-evolving realm of emerging memory technologies, with a specific focus on Resistive RAM (RRAM) and Phase-Change Memory (PCM). The review undertakes a meticulous and comprehensive exploration of these technologies, unraveling their current state, advancements, challenges, and future ...
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Unipolar Memory Operation of Resistance RAM (RRAM) using Compliance Current Controller
Extended Abstracts of the 2008 International Conference on Solid State Devices and Materials, 2008M. Kim, B. Park, O. Kim
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Extended Abstracts of the 2014 International Conference on Solid State Devices and Materials, 2014
C.L. Lin +4 more
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C.L. Lin +4 more
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Circuit design challenges in embedded memory and resistive RAM (RRAM) for mobile SoC and 3D-IC
16th Asia and South Pacific Design Automation Conference (ASP-DAC 2011), 2011Meng-Fan Chang +2 more
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Extended Abstracts of the 2013 International Conference on Solid State Devices and Materials, 2013
C.L. Lin +6 more
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C.L. Lin +6 more
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Multi-Level Switching Characteristics for WO<sub>X</sub> Resistive RAM (RRAM)
Extended Abstracts of the 2008 International Conference on Solid State Devices and Materials, 2008W. C. Chien +11 more
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