Results 161 to 170 of about 389,332 (208)

Doped and Multilayer Variants of Diamond‐Like Carbon Coatings for Biomedical Devices: A Review

open access: yesInternational Journal of Applied Ceramic Technology, Volume 23, Issue 5, October 2026.
This review summarizes advanced surface engineering strategies for diamond‐like carbon (DLC) coatings, specifically focusing on elemental doping (metals and nonmetals) and multilayer architectures, to simultaneously overcome critical challenges such as high intrinsic stress and poor adhesion.
Boyang Shen   +2 more
wiley   +1 more source

Direct Sputtering Deposition of a Zn1−xGexOx+1 Buffer Layer With a Controllable Conduction Band for Cd‐Free Cu(In,Ga)S2 Solar Cells

open access: yesSolar RRL, Volume 10, Issue 18, 28 September 2026.
This work presents the development of n‐type Zn1−xGexOx+1 using radiofrequency magnetron sputtering to suppress interface recombination at the heterojunction of Cu(In,Ga)S2 (CIGS) solar cells. The solar cell device with the Zn1−xGexOx+1 buffer layer directly deposited on CIGS absorbers demonstrates a conversion efficiency comparable to that of a device
Yota Suzuki   +3 more
wiley   +1 more source

Morphology and Photoelectrochemical Properties of Sputtered WO3:Mo Anodes

open access: yesZeitschrift für anorganische und allgemeine Chemie, Volume 652, Issue 14, 23 September 2026.
WO3:Mo thin films for photoelectrochemical water splitting were deposited by sputtering from a W:Mo target. Substrate temperature, pressure, oxygen partial pressure, deposition rate, and film thickness were systematically varied. The results show that the substrate temperature is the dominant parameter governing both the film morphology and the ...
David Adner   +8 more
wiley   +1 more source

Tailoring Functional Properties of Ti–Ni–Cu Shape Memory Alloy Thin Films for MEMS Actuators

open access: yesAdvanced Engineering Materials, Volume 28, Issue 17, 9 September 2026.
A comprehensive study of critical parameters required to develop well‐performing Ti–Ni–Cu thin film shape memory alloy microactuators is provided. Materials science and device integration aspects are integrated by addressing structural and physical relationships using complementary characterization techniques as well as a practical fabrication solution
Elaheh Akbarnejad   +6 more
wiley   +1 more source

Home - About - Disclaimer - Privacy