EFAB: Batch Production of Functional, Fully-Dense Metal Parts with Micron-Scale Features [PDF]
EFAB (Electrochemical FABrication) is a new SFF process with the potential to economically fabricate prototypes or mass production quantities of functional, mesoscale-microscale parts and mechanisms. EFAB generates an entire layer simultaneously-versus
Cohen, Adam +5 more
core +1 more source
Harnessing Fungal Biowelding for Constructing Mycelium‐Engineered Materials
Mycelium‐bound composites (MBCs) offer low‐carbon alternatives for construction, yet interfacial bonding remains a critical challenge. This review examines fungal biowelding as a biocompatible adhesive, elucidating mycelium‐mediated interfacial mechanisms and their role in material assembly. Strategies to optimize biowelding are discussed, highlighting
Xue Brenda Bai +2 more
wiley +1 more source
Free spectral range electrical tuning of a high quality on-chip microcavity
Reconfigurable photonic circuits have applications ranging from next-generation computer architectures to quantum networks, coherent radar and optical metamaterials.
Baker, Christopher G. +6 more
core +1 more source
Porosity through reduction in metal oxides [PDF]
Routes to porous materials with nanoscale dimensions have been investigated. In the first example presented, porous manganese oxide has been prepared by leaching Ni metal from a nickel-manganese oxide precursor via reduction.
Corr, S.A. +2 more
core +1 more source
Powder metal processing provides scalable advantages in nanoporous (np) metal development. Mechanical alloying is used to produce unique precursors for hybrid nanopore formation by oxide reduction and dealloying. As demonstrated in np Ag, this approach improves process efficiency while promoting smaller ligaments and larger pores, both of which are ...
Mark A. Atwater, Oliver A. Fowler
wiley +1 more source
Formation of oxidation induced stacking sacrificial thinning of SIMOX materials
Sacrificial thermal oxidation of standard SIMOX is currently the main route to form ultra thin film SIMOX structures. During the oxidation process self interstitials are injected into the silicon overlayer and these point defects can lead to the growth of secondary defects, in particular oxidation induced stacking faults (OISF).
Giles, L. F. +4 more
openaire +3 more sources
Planar Solid‐State Nanopores Toward Scalable Nanofluidic Integration Based on CMOS Technology
We present a scalable silicon‐based fabrication strategy for planar solid‐state nanopores to enable their integration with complex nanofluidic systems. Prototype devices demonstrate normal voltage‐current characteristics, good noise performance, and appreciable streaming currents. Our CMOS‐compatible fabrication process offers precise geometric control
Ngan Hoang Pham +7 more
wiley +1 more source
Metallization and biopatterning on ultra-flexible substrates via dextran sacrificial layers. [PDF]
Micro-patterning tools adopted from the semiconductor industry have mostly been optimized to pattern features onto rigid silicon and glass substrates, however, recently the need to pattern on soft substrates has been identified in simulating cellular ...
Peter Tseng +2 more
doaj +1 more source
Additive Gaussian Process Regression for Predictive Design of High‐Performance, Printable Silicones
A chemistry‐aware design framework for tuning printable polydimethylsiloxane (PDMS) for vat photopolymerization (VPP) is developed using additive Gaussian process (GP) modeling. Polymer network mechanics informs variable groupings, feasible formulation constraints, and interaction variables.
Roxana Carbonell +3 more
wiley +1 more source
A‐Site Cationic Variation to Expand the Sacrificial Layer AVO3 Family Dissolving in Water
In the growing field of low‐cost electronics, the epitaxy of complex oxide thin films on a Si substrate requires significant technical means. Therefore, a large attention is paid to the release of a freestanding oxide of interest from its deposition ...
Vincent Polewczyk +14 more
doaj +1 more source

