Results 201 to 210 of about 464,081 (300)
Electrospun poly-4-hydroxybuterate scaffolds enable local zero-order estradiol delivery and promote collagen maturation in a hypoestrogenic rat model for pelvic organ prolapse repair. [PDF]
Oosthuysen A +4 more
europepmc +1 more source
Single‐ and Dual‐Atom Configurations in Atomically Dispersed Catalysts for Lithium–Sulfur Batteries
Single‐atom and dual‐atom‐based atomically dispersed catalysts (ADCs) effectively address the shuttle effect and sluggish redox kinetics in Li–S batteries. With nearly 100% atomic utilization and tunable coordination environments, ADCs enhance LiPSs adsorption, lower conversion barriers, and accelerate sulfur redox reactions.
Haoyang Xu +4 more
wiley +1 more source
A multifunctional EGCG/Si nanohybrid-coated 3D-printed porous scaffold for bone defect repair. [PDF]
Xiao S +8 more
europepmc +1 more source
CFD models for wallshear stress estimation; a comparitive study of two complete scaffold geometries [PDF]
Maes, Frédéric +5 more
core +1 more source
A swelling‐programmed micropatterned hydrogel guides adherent cells through a controlled transition from cell–matrix anchoring to cadherin‐mediated cell–cell compaction, enabling rapid assembly of high‐viability spheroids with defined size and morphology.
Han Gyeol Nam +8 more
wiley +1 more source
3D-printed core-shell scaffolds with a biphasic calcium phosphate core and GelMA hydrogel shell for bone tissue engineering. [PDF]
Shadi A +3 more
europepmc +1 more source
Butterfly wing scales are intricate cuticular functional nanosctructures. This perspective suggests that spatially varying material properties, cytoskeletal constraints, and growth‐driven mechanical instabilities shape the resulting nanoscale architectures created from single cells.
Anupama Prakash +10 more
wiley +1 more source
Silk cryogel and electrospun scaffold characterization for bone-tendon interface applications. [PDF]
Anup A +5 more
europepmc +1 more source
Auxeticity‑by‑Assembly converts freeform photovoltaics from cut‑defined layouts to assembly‑defined systems. Standardized interlocking units generate negative‑Poisson‑ratio, reconfigurable architectures, while hinge regions are wired by selectively activatable AgNW–GO@EGaIn composite interconnects and a folding‑enabled interconnector layer. A decimeter‑
Seok Joon Hwang +15 more
wiley +1 more source

