Results 211 to 220 of about 86,576 (325)

Intrinsic nanofilament pathways in molecular crystals enable energy-efficient and reliable memristors. [PDF]

Natl Sci Rev
Liu Y.
europepmc   +1 more source

A Framework for Determining the Reliability of Nanoscale Metallic Oxide Semiconductor (MOS) Devices

, 2010
Wilkistar Otieno
openalex   +1 more source

Unraveling Quantitative Sensing Mechanism and Predictive Molecular Metrics for High‐Performance OFET Amine Sensors

Advanced Functional Materials, EarlyView.
This study introduces a novel chloro boron subphthalocyanine/polymer blend OFET sensor achieving 0.005 ppb limit of detection for ammonia at room temperature and high selectivity against similar amines. An original theoretical framework is proposed to describe the sensing mechanism, relating analyte molecular volume and Lewis basicity to sensor ...
Kavinraaj Ella Elangovan, Matthew P. Confer, Rui Zhang, Siqing Wang, Jeffrey S. Moore, Rohit Bhargava, Ying Diao   +6 more
wiley   +1 more source

Graphene-, Transition Metal Dichalcogenide-, and MXenes Material-Based Flexible Optoelectronic Devices. [PDF]

Nanomaterials (Basel)
Wang Y, Zhou G, Zhang Z, Zhu Z.
europepmc   +1 more source

Long-term Reliability Evaluation of Power Semiconductor Devices used in Power Station Rectifiers and Substation Rectifiers

, 2000
T. Horiuchi, Yoshitaka Sugawara
openalex   +2 more sources

Conductive Bonding and System Architectures for High‐Performance Flexible Electronics

Advanced Functional Materials, EarlyView.
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley   +1 more source

Analysis of physical mechanisms for channel-length-dependent PBTS reliability in SA TG coplanar IGZO TFTs. [PDF]

Sci Rep
Son DH, Oh CE, Lee HW, Jeong CY, Jang JM, Ahn BD, Bae JU, Kwon HI.   +7 more
europepmc   +1 more source

Reliability of Thermal Interface Materials for Power Semiconductor Devices

, 2017
Henrik Forsback
openalex   +1 more source

Special Issue. Surface Finishing for Electronics Parts. The Influence of Adhesive Property of Epoxy Molding Compound to Reliability of Semiconductor Devices.

, 1993
H. Tabata
openalex   +2 more sources

Electric Field‐Dependent Conductivity as Probe for Charge Carrier Delocalization and Morphology in Organic Semiconductors

Advanced Functional Materials, EarlyView.
Applying a high electric field to a doped organic semiconductor heats up the charge carrier distribution beyond the lattice temperature, enhancing conductivity. It is shown that the associated effective temperature can be used to extract the effective localization length, which is a characteristic length scale of charge transport and provides ...
Morteza Shokrani, Felix Maximilian Graf, Anton Kompatscher, Dennis Derewjanko, Martijn Kemerink   +4 more
wiley   +1 more source