Results 181 to 190 of about 22,919 (266)
Advances in silicon carbide pressure sensors for high-temperature extreme environment sensing. [PDF]
Wu C +12 more
europepmc +1 more source
This work reports a strategy of engineering charge‐assisted hydrogen bonds to tailor charge transfer channels in HOFs, significantly improving their performance in photocatalytic H2O2 production. ABSTRACT The production of H2O2 via artificial photosynthesis is often limited by inefficient charge‐carrier separation, causing significant charge ...
Yajun Zhao +7 more
wiley +1 more source
Two-photon states meet polarization-gradient metasurfaces for nanometric, low-dose lateral-displacement metrology. [PDF]
Deng QM, Zeng JH, Li FJ, Deng ZL.
europepmc +1 more source
A protocol of fs‐laser‐induced periodic phase‐transition of 2D‐MoTe2 template, inducing AuNPs@1T’‐MoTe2 nanograting, is developed. The labeled AuNPs@1T’‐MoTe2 substrate conjugated with specialized immunoglobulin G demonstrates an unexpectedly high discrimination accuracy close to unity for serological diagnosis of rheumatoid arthritis by frequency ...
Yao Yao +9 more
wiley +1 more source
Correction to "Quasi-Bound State in the Continuum of the Intracoupled All-Dielectric Coherent Metasurface". [PDF]
Liu TH, Wu HY, Cheng WS.
europepmc +1 more source
CMOS‐Integrated Synaptic Photoreceptor Chip Inspired by Insect Visual Processing
CMOS‐integrated Si QDs/ReS2 synaptic photoreceptor array mimics the parallel processing and wavelength‐selective strategy of insect vision. By combining intrinsic ultraviolet‐violet sensitivity with synaptic plasticity, the chip enables frontend sensory redundancy reduction without external filters, offering a scalable pathway toward lowpower ...
Jian Chai +25 more
wiley +1 more source
Towards Ultra-Precision Manufacturing: Advancements and Future Trends in Energy Field-Assisted Jet Machining. [PDF]
He Y, Chen T, Man X, Su T.
europepmc +1 more source
ABSTRACT The multifunctional integration of chips with high flexibility and scalable manufacturing is crucial for enhancing chip performance, reducing chip size, and simplifying chip design. However, balancing volume, cost, flexibility, and functionality using traditional heterogeneous integration methods is challenging.
Lang Chen +7 more
wiley +1 more source
Editorial for Future Trends in Ultra-Precision Machining. [PDF]
Liu C, Zhang Y, Liang X.
europepmc +1 more source
Silicon hot‐carrier photodetectors offer a CMOS‐compatible pathway for SWIR detection but suffer from intrinsically low quantum efficiency. Here, we introduce a quasi‐generalized antireflection coating (QARC) that universally enhances optical absorption and quantum efficiency, enabling the first CMOS‐compatible SWIR imaging with silicon hot‐carrier ...
Eui‐Hyoun Ryu +11 more
wiley +1 more source

