Results 11 to 20 of about 26,154 (258)
An Optimal Shaped Sensor Array Derivation
In Structural Health Monitoring (SHM) applications, the Direction of Arrival (DoA) estimation of Guided Waves (GW) on sensor arrays is often used as a fundamental means to locate Acoustic Sources (AS) generated by damages growth or undesired impacts in thin-wall structures (e.g., plates or shells).
Marco Dibiase, Luca De Marchi
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The horizontal floating linear array is a new type of array used to detect deep-sea targets. Reliable target detection depends on the estimation accuracy of the array shape.
Zonglun Che +5 more
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In order to minimize the electromagnetic interference in the detection system in robot finger pressure tactile measurement, a fiber Bragg grating pressure tactile sensor array with the advantages of anti electromagnetic interference, small volume, light ...
LU Guan, LIU Honglin, XU Yiming
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A High-Precision Three-Dimensional Probe Array Temperature Sensor
To meet the need for micro-volume devices for high-precision measurement of temperature, Cu-Constantan (CuNi45) thin films with a novel array structure of thermo-electrodes were designed and fabricated.
Bian Tian +8 more
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Ultra-low-power is a key performance indicator in 6G-IoT ecosystems. Sensor nodes in this eco-system are also capable of running light-weight artificial intelligence (AI) models.
Shiv Nath Chaudhri +4 more
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Optimal node density for two-dimensional sensor arrays [PDF]
The problem of optimal node density for ad hoc sensor networks deployed for making inferences about two dimensional correlated random fields is considered. Using a symmetric first order conditional autoregressive Gauss-Markov random field model, large deviations results are used to characterize the asymptotic per-node information gained from the array.
Youngchul Sung +2 more
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In a new E-nose development, the sensor array needs to be optimized to have enough sensitivity and selectivity for gas/odor classification in the application.
Zhenghao Mao +4 more
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Internal defect identification method of TSV 3D packaging based on built-in integrated sensor
TSV (Through Silicon Via) is a key technology for three-dimensional (3D) packaging due to its unique vertical interconnection method. However, its particular manufacturing process of-ten leads to internal defects, such as gaps, bottom voids, filling ...
Lei Nie +5 more
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The beam pattern of the virtual node antenna array (VNAA) in wireless sensor networks has a high maximum sidelobe level (SLL), thereby causing communication interference because of the uncontrollable node positions.
Geng Sun +6 more
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Optimization of Planar Interdigitated Microelectrode Array for Enhanced Sensor Responses
Immunoassays play a pivotal role in detecting and quantifying specific proteins within biological samples. However, its sensitivity and turnaround time are constrained by the passive diffusion of target molecules towards the sensors.
Sakib Islam, Jie Wu
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