Results 111 to 120 of about 2,185,055 (279)

High‐Entropy Alloy Interlayers Toward Advanced Joining for High‐Performance Structural Applications: Current Progress and Emerging Challenges

open access: yesAdvanced Engineering Materials, EarlyView.
HEA interlayers offer a versatile route for joining high‐performance structural materials. Their compositional and structural design regulates interfacial reactions, suppresses brittle IMCs, and improves metallurgical bonding. Sandwich interlayers further integrate defect healing with precipitation strengthening, enabling improved strength–ductility ...
Lin Yuan   +4 more
wiley   +1 more source

A Novel Approach to Estimate the Transition Temperature via Dynamic Nanoindentation

open access: yesAdvanced Engineering Materials, EarlyView.
A new dynamic nanoindentation‐based method was developed that uses the stiffness ratio as an indicator of the elastic–plastic deformation contributions at different temperatures. The approach successfully identified transition temperatures in ferritic steel and distinguished them from continuously ductile austenitic steel.
Stefan Zeiler   +4 more
wiley   +1 more source

Deneysel bulgular ışığında Türkiye’de cari açığın bileşenleri üzerine bir inceleme

open access: yes, 2013
Bu çalışmada kronik bir sorun haline gelen cari açığın bileşenlerinin tespit edilmesi amaçlanmıştır. Bu amaçla VAR modeline dayanan bir ekonometrik analiz yapılmış ve analizde cari işlemler açığı, net dış aktifler, reel kur sepeti, ticari banka ...
DEMİRCİ, SERVER
core  

OF E2/E2/1/m QUEUEING SYSTEM SUBJECT TO OPERATEDEPENDENT SERVER BREAKDOWNS

open access: yesPerner’s Contacts, 2012
The paper deals with modelling of a finite single-server queueing system with a server subject to breakdowns. Customers interarrival times and customers service times follow the Erlang distribution defined by the shape parameter k=2 and the scale ...
Michal Dorda
doaj  

Stretching the Printability Metric in Direct‐Ink Writing with Highly Extensible Yield‐Stress Fluids

open access: yesAdvanced Functional Materials, EarlyView.
This study introduces “drawability” as a new metric for assessing printability in direct‐ink writing, focusing on gap‐spanning performance and speed robustness. By designing yield‐stress fluids with high extensibility, we demonstrate that extensional strain‐to‐break significantly enhances printability.
Chaimongkol Saengow   +9 more
wiley   +1 more source

Breakdown Point Theory for Implied Probability Bootstrap [PDF]

open access: yes
This paper studies robustness of bootstrap inference methods under moment conditions. In particular, we compare the uniform weight and implied probability bootstraps by analyzing behaviors of the bootstrap quantiles when outliers take arbitrarily large ...
Lorenzo Camponovo, Taisuke Otsu
core  

Estimating the Reliability of the Elements of Cloud Services

open access: yesOperations Research and Decisions, 2017
Cloud technologies are a very considerable area that influence IT infrastructure, network services and applications. Research has highlighted difficulties in the functioning of cloud infrastructure.
Iuliia V. Ignatova, Anatoliy V. Biehun
doaj  

Performance Analysis and Reliability Prediction of Multi‐State Service Systems With Multiple Failure Modes of Unreliable Server: An Engineering Perspective

open access: yesEngineering Reports
The long‐term reliability of a machining system is essential for ensuring the uninterrupted operation of an automated manufacturing process. For maintaining optimal system performance, it is essential to model and analyze the system's reliability and ...
Shreekant Varshney   +4 more
doaj   +1 more source

Implementation of two-factor user authentication in computer systems

open access: yesVojnotehnički Glasnik
Introduction/purpose: The paper explores the implementation of two-factor authentication (2FA) in computer systems, addressing the increasing need for enhanced security.
Mihailo D. Tomić, Olivera M. Radojević
doaj   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

open access: yesAdvanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone   +11 more
wiley   +1 more source

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