Results 41 to 50 of about 170,031 (197)
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan+5 more
wiley +1 more source
This study explores a crystal‐symmetry‐based approach to optimize mechanical properties in laser powder bed fused AISI 316L with predominant {110}<100> Goss textures. By varying the build orientation, the microstructure can be tailored and the tensile properties optimized. The tilted build (T110) achieved the highest strength while preserving ductility,
Daniel Rainer+7 more
wiley +1 more source
This study presents a hyperelastic mechanical metamaterial for elastic energy dissipation. Energy is dissipated within its unit cells by friction assisted by material damping. Frictional contact is enhanced when using auxetic unit cells. The load–displacement plot for one compression cycle shows a pronounced hysteresis loop, indicating that a large ...
Eunhyeuk Jeong+2 more
wiley +1 more source
Toughness of Confined Auxetic Foams
Auxetic (negative Poisson's ratio) materials offer benefits such as impact mitigation, thermal insulation, vibration damping, and reduced shear strain, although their fracture mechanics are largely unexplored. This study investigates damage initiation and propagation in confined re‐entrant auxetic foams from polyurethane via experimental ...
Adrianos E. F. Athanasiadis+3 more
wiley +1 more source
This study presents a multimodal characterization method for a prototype metamaterial model structure that features four distinct states of mechanical stiffness and electrical resistivity. Through simulations and experiments, it uncovers insights into the structural behavior, the correlation between changes in electrical resistivity and mechanical ...
Rebecca Kose+3 more
wiley +1 more source
In the present study, metastable CrMnNi steels with varying chemical compositions and a concomitantly altered stacking fault energy are processed via directed energy deposition and afterwards tested via tensile tests at different temperatures. The present study shows the influence of the manufacturing process on the elemental deformation mechanisms for
Julia Richter+8 more
wiley +1 more source
Key Trends and Insights in Smart Polymeric Skin Wearable Patches
Intelligent polymers, which respond to various physical and biological stimuli, are explored for the development of skin wearable patches in biomedical applications. Smart polymers, also known as intelligent or stimuli‐responsive polymers, play a crucial role in the development of advanced wearable patches due to their versatility and softness.
Sergio J. Peñas‐Núñez+2 more
wiley +1 more source
Equal channel angular pressing of commercial pure copper under low strain amplitude (≈0.48) induces concurrent continuous and localized discontinuous dynamic recrystallization, forming a duplex structure influenced by strain heterogeneity and recovery. Moderate hardening after 4–12 passes results from progressive high‐angle grain boundary formation via
Paula Cibely Alves Flausino+6 more
wiley +1 more source
A machine learning‐driven framework is introduced to optimize 3D‐printable microneedles for enhanced tissue anchoring and reduced insertion damage. The optimized design achieves a 6.0‐fold improvement in pull‐out‐to‐penetration energy ratio over conventional shapes.
Jegyeong Ryu+5 more
wiley +1 more source
This article presents a comprehensive analysis of the intrinsic relationships and applicability of Hill48 yield criterion. The applicability and error evaluation conditions for Hill48 are established based on specific experimental data. A parameter calibration strategy for N‐value based on error minimization is proposed, and the predictive accuracy is ...
Jinxin Wang+9 more
wiley +1 more source