Results 191 to 200 of about 1,030,038 (390)

Viscoelasticity, Lubricity, and Wear Prevention of Cross‐Linked Mucin Gels

open access: yesAdvanced Materials Interfaces, EarlyView.
Physiologically, biolubrication by mucus reduces friction and protects tissues from tribological stress, with mucins playing a key role. This study compares mucin‐based gels with distinct crosslinking architectures to explore their effect on the lubrication and wear prevention abilities of reconstituted mucin gels.
Chiara Gunnella   +2 more
wiley   +1 more source

Fingerprint on Ballistic after Shooting

open access: yes, 2014
This research involved fingerprints on ballistics after shooting. Two objectives of research were as follow; (1) to study the duration of the existence of latent fingerprints on .38, .45, 9 mm and .223 cartridge case after shooting, and (2) to compare the effectiveness of the detection of latent fingerprints by Black Powder, Super Glue, Perma Blue and ...
openaire   +18 more sources

Role of WUSCHEL in Regulating Stem Cell Fate in the Arabidopsis Shoot Meristem

open access: yesCell, 1998
K. Mayer   +5 more
semanticscholar   +1 more source

Enhancing Plasma Electrolytic Oxidation (PEO) Coatings on Magnesium Alloys: The Critical Role of Surface Pretreatments

open access: yesAdvanced Materials Interfaces, EarlyView.
This review explores how various surface pretreatment methods—such as heat treatment, severe plastic deformation, laser modification, immersion, and cold spray—enhance the performance of PEO coatings on magnesium alloys. The study highlights how these pretreatments influence coating microstructure, adhesion, and corrosion resistance, offering new ...
Arash Fattah‐alhosseini   +5 more
wiley   +1 more source

Biocompatible Porphyrin Derivatives Electron Beam and Extreme Ultraviolet Photoresists: High Resolution and High Etch Resistance

open access: yesAdvanced Materials Interfaces, EarlyView.
Porphyrin derivatives are introduced for electron beams and extreme ultraviolet lithography. The lithographic performance of the novel CuTP‐4Epoxy photoresist is excellent, with a resolution of 18 nm in EBL and 20 nm in EUVL, and the photoresist also exhibits high etch resistance.
Yurui Wu   +14 more
wiley   +1 more source

Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging

open access: yesAdvanced Materials Technologies, EarlyView.
Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek   +4 more
wiley   +1 more source

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